生命周期: | Transferred | 零件包装代码: | DIP |
包装说明: | 0.400 INCH, CERAMIC, DIP-32 | 针数: | 32 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.06 |
最长访问时间: | 35 ns | JESD-30 代码: | R-CDIP-T32 |
JESD-609代码: | e4 | 长度: | 40.64 mm |
内存密度: | 1048576 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 8 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 32 |
字数: | 131072 words | 字数代码: | 128000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 128KX8 |
输出特性: | 3-STATE | 可输出: | YES |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | DIP |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 4.34 mm | 最小待机电流: | 2 V |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | PALLADIUM GOLD | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
宽度: | 10.16 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
8959811BZX | MICROSS |
获取价格 |
SRAM | |
8959812BTA | MICROSS |
获取价格 |
Standard SRAM, 128KX8, 25ns, CMOS, CDFP32, CERAMIC, FP-32 | |
8959812BTX | MICROSS |
获取价格 |
SRAM | |
8959812BUA | MICROSS |
获取价格 |
Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, CERAMIC, LCC-32 | |
8959812BUX | MICROSS |
获取价格 |
SRAM | |
8959812BXA | MICROSS |
获取价格 |
Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | |
8959812BXC | MICROSS |
获取价格 |
Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | |
8959812BZA | MICROSS |
获取价格 |
Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 | |
8959813BTC | MICROSS |
获取价格 |
Standard SRAM, 128KX8, 120ns, CMOS, CDFP32, CERAMIC, FP-32 | |
8959813BUA | MICROSS |
获取价格 |
Standard SRAM, 128KX8, 120ns, CMOS, CDSO32, CERAMIC, LCC-32 |