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8634BY-01LF PDF预览

8634BY-01LF

更新时间： 2024-01-01 12:15:55
品牌 Logo 应用领域
艾迪悌 - IDT 驱动逻辑集成电路
页数 文件大小 规格书
17页 284K
描述
TQFP-32, Tray

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8634BY-01LF 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：TQFP
包装说明：7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BBA, LQFP-32针数：32
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：8.62
系列：8634输入调节：DIFFERENTIAL MUX
JESD-30 代码：S-PQFP-G32JESD-609代码：e3
长度：7 mm逻辑集成电路类型：PLL BASED CLOCK DRIVER
湿度敏感等级：3功能数量：1
反相输出次数：端子数量：32
实输出次数：5最高工作温度：70 °C
最低工作温度：封装主体材料：PLASTIC/EPOXY
封装代码：LQFP封装等效代码：QFP32,.35SQ,32
封装形状：SQUARE封装形式：FLATPACK, LOW PROFILE
峰值回流温度（摄氏度）：260电源：3.3 V
Prop。Delay @ Nom-Sup：4.2 ns传播延迟（tpd）：4.2 ns
认证状态：Not QualifiedSame Edge Skew-Max（tskwd）：0.025 ns
座面最大高度：1.6 mm子类别：Clock Drivers
最大供电电压 (Vsup)：3.465 V最小供电电压 (Vsup)：3.135 V
标称供电电压 (Vsup)：3.3 V表面贴装：YES
温度等级：COMMERCIAL端子面层：Matte Tin (Sn) - annealed
端子形式：GULL WING端子节距：0.8 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：7 mm最小 fmax：700 MHz
Base Number Matches：1

8634BY-01LF 数据手册

 浏览型号8634BY-01LF的Datasheet PDF文件第7页浏览型号8634BY-01LF的Datasheet PDF文件第8页浏览型号8634BY-01LF的Datasheet PDF文件第9页浏览型号8634BY-01LF的Datasheet PDF文件第11页浏览型号8634BY-01LF的Datasheet PDF文件第12页浏览型号8634BY-01LF的Datasheet PDF文件第13页 
ICS8634-01  
1-TO-5 DIFFERENTIAL-TO-3.3V LVPECL  
ZERO DELAY BUFFER  
POWER CONSIDERATIONS  
This section provides information on power dissipation and junction temperature for the ICS8634-01.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS8634-01 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for VCC = 3.3V + 5ꢀ = 3.465V, which gives worst case results.  
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.  
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 150mA = 520mW  
Power (outputs)MAX = 30mW/Loaded Output pair  
If all outputs are loaded, the total power is 5 * 30mW = 150mW  
Total Power_MAX (3.465V, with all outputs switching) = 520mW + 150mW = 670mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of  
the device. The maximum recommended junction temperature for the devices is 125°C.  
JA  
A
The equation for Tj is as follows: Tj = θ * Pd_total + T  
Tj = Junction Temperature  
JA  
θ
= Junction-to-Ambient Thermal Resistance  
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)  
A
T = Ambient Temperature  
JA  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ must be used. Assuming  
a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 7A below.  
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:  
70°C + 0.670W * 42.1°C/W = 98.2°C. This is well below the limit of 125°C.  
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,  
and the type of board (single layer or multi-layer).  
JA  
TABLE 7A. THERMAL RESISTANCE θ FOR 32-PIN LQFP, FORCED CONVECTION  
θ
JA by Velocity (Linear Feet per Minute)  
0
200  
500  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
67.8°C/W  
55.9°C/W  
50.1°C/W  
47.9°C/W  
42.1°C/W  
39.4°C/W  
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.  
TABLE 7B. θJAVS. AIR FLOW TABLE FOR 32 LEAD VFQFN PACKAGE  
θ
JA 0 Air Flow (Linear Feet per Minute)  
0
Multi-Layer PCB, JEDEC Standard Test Boards  
34.8C/W  
8634BY-01  
www.idt.com  
REV. D MAY 12, 2014  
10  
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