Datasheet > 8503004CA

8503004CA

更新时间： 2024-02-04 16:42:50

品牌	Logo	应用领域
西伯斯 - SIPEX		输出元件
页数	文件大小	规格书
14页	92K
描述
Three Terminal Voltage Reference, 1 Output, 10V, Trim/Adjustable, Hybrid, CDIP14, CERAMIC, DIP-14

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技术参数
数据手册

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8503004CA 技术参数

生命周期：	Obsolete	零件包装代码：	DIP
包装说明：	DIP,	针数：	14
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.84
其他特性：	ADDITIONAL NOMINAL OUTPUT VOLTAGE OF -10V IS AVAILABLE	模拟集成电路 - 其他类型：	THREE TERMINAL VOLTAGE REFERENCE
JESD-30 代码：	R-GDIP-T14	功能数量：	1
输出次数：	1	端子数量：	14
最高工作温度：	125 °C	最低工作温度：	-55 °C
标称输出电压：	10 V	封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DIP	封装形状：	RECTANGULAR
封装形式：	IN-LINE	认证状态：	Not Qualified
筛选级别：	MIL-STD-883	最大供电电压 (Vsup)：	16.5 V
最小供电电压 (Vsup)：	13.5 V	标称供电电压 (Vsup)：	15 V
表面贴装：	NO	最大电压温度系数：	9 ppm/ °C
温度等级：	MILITARY	端子形式：	THROUGH-HOLE
端子位置：	DUAL	微调/可调输出：	YES
Base Number Matches：	1

8503004CA 数据手册

Case outline X.

Symbol

Inches

Millimeters

Notes

Min

.215

.175

.016

.860

.490

.295

Max

.250

.215

.020

.885

.520

.305

Max

5.46

4.44

Min

6.35

5.46

A₁

∅b

E₁

0.41

0.51

21.84

12.45

7.49

22.48

13.21

7.75

.100 BSC

2.54 BSC

.130

.255

.290

.035

.160

.180

15°

3.30

3.81

0.51

2.54

2.03

0°

6.48

7.37

0.89

4.07

4.57

15°

L₁

S₁

.150

.020

.100

.080

0°

NOTES:

1. Index area: A notch, square-package corner, or a pin one index point shall be located adjacent to pin one and

within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark.

2. Dimension Q shall be measured from the seating plane to the base plane.

3. This dimension allows for off-center lid, meniscus, and weld squash.

4. The basic pin spacing is .100 inch (2.54 mm) between centerlines. Each pin centerline shall be located within

±.010 inch (0.25 mm) of its exact longitudinal position relative to pins 1 and 14.

5. Dimension S₁is not used.

6. Lead center when α = 00. E₁shall be measured at the centerline of the leads (see MIL-STD-1835).

7. All leads: Increase maximum limit by .003 inch (0.08 mm) measured at the widest diameter when lead finish A or B

is applied.

8. If this configuration is used, no polymer or organic materials shall be applied or molded to the bottom of the

package or cover the leads.

FIGURE 1. Case outline(s).

SIZE

STANDARD

MICROCIRCUIT DRAWING

85030

REVISION LEVEL

SHEET

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

1...4 5 678 9 10...14

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