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8430AYI-71LF PDF预览

8430AYI-71LF

更新时间: 2024-02-05 07:39:11
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
16页 211K
描述
Clock Generator, PQFP32

8430AYI-71LF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:QFP, QFP32,.35SQ,32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.33
JESD-30 代码:S-PQFP-G32JESD-609代码:e3
湿度敏感等级:3端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装等效代码:QFP32,.35SQ,32封装形状:SQUARE
封装形式:FLATPACK峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
子类别:Clock Generators标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING端子节距:0.8 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
Base Number Matches:1

8430AYI-71LF 数据手册

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ICS8430I-71  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z, LOW  
J
ITTER, CRYSTAL  
I
NTERFACE  
/
LVCMOS-TO-3.3V LVPECL FREQUENCY  
SYNTHESIZER  
POWER CONSIDERATIONS  
This section provides information on power dissipation and junction temperature for the ICS8430I-71.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS8430I-71 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.  
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.  
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 140mA = 485mW  
Power (outputs)MAX = 30.2mW/Loaded Output pair  
If all outputs are loaded, the total power is 2 * 30.2mW = 60.4mW  
Total Power_MAX (3.465V, with all outputs switching) = 485mW + 60.4mW = 545.4mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the  
device.The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.  
The equation for Tj is as follows: Tj = θJA * Pd_total + TA  
Tj = JunctionTemperature  
θJA = Junction-to-AmbientThermal Resistance  
Pd_total =Total Device Power Dissipation (example calculation is in section 1 above)  
TA = AmbientTemperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a  
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W perTable 8 below.  
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:  
85°C + 0.485W * 42.1°C/W = 105.4°C. This is well below the limit of 125°C.  
This calculation is only an example.Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,  
and the type of board (single layer or multi-layer).  
TABLE 8. THERMAL RESISTANCE θJA FOR 32-PIN LQFP, FORCED CONVECTION  
θJA byVelocity (Linear Feet per Minute)  
0
200  
55.9°C/W  
42.1°C/W  
500  
50.1°C/W  
39.4°C/W  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
67.8°C/W  
47.9°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
8430AYI-71  
www.icst.com/products/hiperclocks.html  
REV. B JANUARY 27, 2005  
11  

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