1.90 by 1.35mm
(.075” by .053”) Pitch
ImpactTM
FEATURES AND SPECIFICATIONS
Backplane Connector System
3- and 4-Pair
Three-pair backplane connector system now available; Molex’s Impact backplane connector
system pushes the speed and density envelope to meet the growing demands of next generation
telecommunication and data networking equipment
The Impact backplane connector system provides data
rates over 20 Gbps and superior signal density up to 80 This reduces the average mating force per connector
differential pairs per inch. The Impact System’s broad- to improve the mechanical mating performance of
performance and built-in ground-signal sequencing.
76165 3-Pair Backplane
Signal Headers
76155 4-Pair Backplane
Signal Headers
76170 3-Pair Daughtercard
Connectors
76160 4-Pair Daughtercard
Connectors
edge-coupled technology enables low cross-talk and high the system.
signal bandwidth while minimizing channel performance
The Impact backplane connector system is designed for
variation across every differential pair within the system.
Three-pair backplane headers and daughtercard
connectors are the latest addition to the Impact product
line, providing more size and density options.
traditional backplane and/or midplane architectures
to meet the growing demands of next-generation
telecommunication and data networking equipment
manufacturers. The Impact connector system is
currently offered in 3- and 4-pair versions, with a
Molex’s Impact System offers multiple compliant-pin
design options on both the daughtercard and backplane complete range of guidance and power-solution options.
connectors, providing customers ultimate flexibility
to optimize their designs for superior mechanical and
electrical performance. The Impact system’s mating
interface provides inline-staggered, bifurcated contacts
that provide 2 points of contact for long-term reliability
Two, five and six-pair versions are also available.
For more information on Molex’s Impact backplane
connector system, contact impact@molex.com.
Features and Benefits
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PCB routing flexibility provides simple 1.90 by
Data rates over 20 Gbps support future system
1.35mm (.075 by .053”) grid on both backplane
and daughtercard reduces PCB routing complexity
and costs
performance upgrades
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Broad-edge-coupled, differential-pair system for
superior density, low cross-talk, low insertion loss
and minimal performance variation across all high-
speed channels
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Two compliant-pin attach options provide customers
ultimate flexibility to optimize their designs for
superior mechanical and electrical performance
Impact 3-Pair Daughtercard and Backplane
with Integrated Guidance
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Differential pair density up to 80 pairs per
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Inline staggered, bifurcated contact beams in
linear inch provides the highest speed, highest
differential pair density per square inch in the
industry
daughtercard interface for superior mating
performance with two points of contact for
long-term reliability and built-in ground-signal
sequencing
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IEEE 10GBASE-KR and Optical Internetworking
Forum (OIF) Stat Eye Compliant channel
performance demonstrates end-to-end channel
performance compliance
Impact 4-Pair by 10-Column Red Card Demo
SPECIFICATIONS
Reference Information
Packaging: Trays
UL File No.: Pending
CSA File No.: Pending
Designed In: Millimeters
Mechanical
Contact Insertion Force:
Physical
Housing: Liquid Crystal Polymer, UL 94V-0
Contact: High Performance Copper (Cu) Alloy
Plating:
26.7N (6.0 lb) per contact.
Contact Retention Force:
4.45N (1.0 lb) min. per contact
Mating Force: 0.30N (0.07 lb) max. per contact
Durability: 200 cycles
Contact Area – 0.76µm (30µ”) Gold (Au) min.
Solder Tail Area – Tin (Sn) or Tin/Lead (Sn/Pb)
Underplating – Nickel (Ni)
Electrical
Signal Contact Current Rating: 1.0A
Contact to Plated Through-Hole Resistance:
1.0 milliohm max.
PCB Thickness: 1.60mm (.062”) typical
Operating Temperature: -55 to +85°C max.
Dielectric Withstanding Voltage: 750V RMS
Insulation Resistance: 10,000 Megohms min.
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