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74AUP1G126DCKTE4 PDF预览

74AUP1G126DCKTE4

更新时间: 2024-01-24 22:47:22
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路光电二极管输出元件
页数 文件大小 规格书
26页 1023K
描述
LOW-POWER SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT

74AUP1G126DCKTE4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:TSSOP, TSSOP5/6,.08针数:5
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.37控制类型:ENABLE HIGH
系列:AUP/ULP/VJESD-30 代码:R-PDSO-G5
JESD-609代码:e4长度:2 mm
负载电容(CL):30 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.0017 A湿度敏感等级:1
位数:1功能数量:1
端口数量:2端子数量:5
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP5/6,.08封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260电源:1.2/3.3 V
Prop。Delay @ Nom-Sup:21.4 ns传播延迟(tpd):21.4 ns
认证状态:Not Qualified座面最大高度:1.1 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):0.8 V标称供电电压 (Vsup):1.2 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.25 mmBase Number Matches:1

74AUP1G126DCKTE4 数据手册

 浏览型号74AUP1G126DCKTE4的Datasheet PDF文件第1页浏览型号74AUP1G126DCKTE4的Datasheet PDF文件第2页浏览型号74AUP1G126DCKTE4的Datasheet PDF文件第3页浏览型号74AUP1G126DCKTE4的Datasheet PDF文件第5页浏览型号74AUP1G126DCKTE4的Datasheet PDF文件第6页浏览型号74AUP1G126DCKTE4的Datasheet PDF文件第7页 
SN74AUP1G126  
SCES596F JULY 2004REVISED MAY 2010  
www.ti.com  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX UNIT  
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Output voltage range in the high or low state(2)  
4.6  
4.6  
4.6  
V
V
VO  
VO  
IIK  
V
–0.5 VCC + 0.5  
V
Input clamp current  
VI < 0  
–50  
–50  
±20  
±50  
206  
252  
142  
TBD  
234  
132  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCC or GND  
DBV package  
DCK package  
DRL package  
qJA  
Package thermal impedance(3)  
°C/W  
°C  
DSF package  
DRY package  
YFP/YZP/YZT package  
Tstg  
Storage temperature range  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The package thermal impedance is calculated in accordance with JESD 51-7.  
4
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Product Folder Link(s): SN74AUP1G126  

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