Datasheet > 74AHC1G125GM,132

74AHC1G125GM,132

更新时间： 2024-01-07 22:04:09

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
17页	200K
描述
74AHC(T)1G125 - Bus buffer/line driver; 3-state SON 6-Pin

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技术参数
数据手册

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74AHC1G125GM,132 技术参数

是否Rohs认证：	符合	生命周期：	Transferred
零件包装代码：	SON	包装说明：	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
针数：	6	Reach Compliance Code：	compliant
风险等级：	7.97	Base Number Matches：	1

74AHC1G125GM,132 数据手册

74AHC1G125; 74AHCT1G125

Bus buffer/line driver; 3-state

Rev. 10 — 23 August 2012

Product data sheet

1. General description

74AHC1G125 and 74AHCT1G125 are high-speed Si-gate CMOS devices. They provide

one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by

the output enable input (OE). A HIGH at OE causes the output to assume a

high-impedance OFF-state.

The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.

The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

2. Features and benefits

 Symmetrical output impedance

 High noise immunity

 Low power dissipation

 Balanced propagation delays

 Multiple package options

 ESD protection:

 HBM JESD22-A114F: exceeds 2000 V

 MM JESD22-A115-A: exceeds 200 V

 CDM JESD22-C101E: exceeds 1000 V

 Specified from 40 C to +125 C

3. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range

40 C to +125 C

Name

Description

Version

74AHC1G125GW

74AHCT1G125GW

74AHC1G125GV

74AHCT1G125GV

74AHC1G125GM

74AHCT1G125GM

74AHC1G125GF

74AHCT1G125GF

TSSOP5

plastic thin shrink small outline package;

5 leads; body width 1.25 mm

SOT353-1

40 C to +125 C

SC-74A

XSON6

plastic surface-mounted package; 5 leads

SOT753

plastic extremely thin small outline package; no SOT886

leads; 6 terminals; body 1  1.45  0.5 mm

plastic extremely thin small outline package;

no leads; 6 terminals; body 1  1  0.5 mm

SOT891

12 3 4 5 6 7...17

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