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73S8024RN-IM/F1 PDF预览

73S8024RN-IM/F1

更新时间: 2024-02-05 18:01:12
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
27页 453K
描述
Analog Circuit, 1 Func, LEAD FREE, QFN-32

73S8024RN-IM/F1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:HVQCCN,Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.66
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:S-XQCC-N32
长度:5 mm功能数量:1
端子数量:32最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
座面最大高度:0.9 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.7 V表面贴装:YES
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:5 mm
Base Number Matches:1

73S8024RN-IM/F1 数据手册

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DS_8024RN_020  
73S8024RN Data Sheet  
4 Card Power Supply  
The card power supply is internally provided by the LDO regulator, and controlled by the digital  
ISO 7816-3 sequencer. Card voltage selection is carried out by the digital input 5V/#V.  
Choice of the VCC Capacitor:  
Depending on the applications, the requirements in terms of both VCC minimum voltage and transient  
currents that the interface must be able to provide to the card are different. An external capacitor must be  
connected between the VCC pin and to the card ground in order to guarantee stability of the LDO  
regulator, and to handle the transient requirements. The type and value of this capacitor can be  
optimized to meet the desired specification. Table 1 shows the recommended capacitors for each VPC  
power supply configuration and applicable specification.  
Table 1: Choice of VCC Pin Capacitor  
Specification Requirements  
System Requirements  
Max  
Min VPC  
Power  
Supply  
Required  
Min VCC Voltage  
Allowed During  
Transient Current  
Transient  
Current  
Charge  
Capacitor  
Specification  
Capacitor Value  
Type  
X5R/X7R  
w/  
ESR <  
EMV 4.0  
ISO 7816-3  
NDS  
4.6V  
4.5V  
4.6V  
30nA.s  
20nA.s  
40nA.s  
4.75V  
4.75V  
4.85V  
3.3 µF  
1 µF  
1 µF  
100mΩ  
Note: Capacitor value for NDS implementation is also defined by the deactivation time requirement.  
5 Over-Temperature Monitor  
A built-in detector monitors die temperature. Upon an over-temperature condition, a card deactivation  
sequence is initiated, and an error or fault condition is reported to the system controller.  
6 On-Chip Oscillator and Card Clock  
The 73S8024RN device has an on-chip oscillator that can generate the smart card clock using an  
external crystal (connected between the pins XTALIN and XTALOUT) to set the oscillator frequency.  
When the clock signal is available from another source, it can be connected to the pin XTALIN, and the  
pin XTALOUT should be left unconnected.  
The card clock frequency may be chosen between four different division rates, defined by digital inputs  
CLKDIV 1 and CLKDIV 2, as per Table 2.  
Table 2: Card Clock Frequency  
CLKDIV1  
CLKDIV2  
CLK  
0
0
1
1
0
1
0
1
XTALIN  
¼ XTALIN  
XTALIN  
½ XTALIN  
Card power down mode (card clock STOP) is supported and is controllable through the dedicated digital  
inputs CLKSTOP and CLKLEV (not supported in the 20QFN package).  
Rev. 2  
9
 
 
 
 
 

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