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73S8023C-DB PDF预览

73S8023C-DB

更新时间: 2024-01-03 00:12:51
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
19页 816K
描述
Demo Board User Manual

73S8023C-DB 技术参数

生命周期:Transferred包装说明:5 X 5 MM, LEAD FREE, QFN-32
Reach Compliance Code:unknown风险等级:5.59
Is Samacsys:N模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:S-XQCC-N32长度:5 mm
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
认证状态:Not Qualified座面最大高度:0.9 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
表面贴装:YES温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD宽度:5 mm
Base Number Matches:1

73S8023C-DB 数据手册

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UM_8023C_027  
73S8023C Demo Board User Manual  
1 Introduction  
The 73S8023C Demo Board is a platform for evaluating the Teridian 73S8023C Smart Card Interface  
device. The board incorporates the 73S8023C integrated circuit and has been designed to operate either  
as a standalone platform (to be used in conjunction with an external microcontroller) or as a daughter  
card to be used in conjunction with the 73S1121F evaluation platform.  
The board has been designed to comply with the EMV 2000 Specification, Version 4.0. 73S8023C Demo  
Boards can easily be modified to comply with NDS specifications by replacing a few external components  
that are highlighted in this document.  
Figure 1: 73S8023C Demo Board  
1.1 Package Contents  
The 73S8023C Demo Board Kit includes:  
A 73S8023C Demo Board  
The following documents on CD:  
73S8023C Data Sheet  
73S8023C Demo Board User Manual (this document)  
Application Note  
1.2 Safety and ESD Notes  
Connecting live voltages to the 73S8023C Demo Board system will result in potentially hazardous  
voltages on the boards.  
Extreme caution should be taken when handling the 73S8023C Demo Board after  
connection to live voltages!  
The 73S8023C Demo Board is ESD sensitive! ESD precautions should be taken when  
handling this board!  
Rev. 1.3  
5
 
 
 
 

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