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73S8023C-DB

更新时间: 2024-01-22 12:58:19
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
19页 816K
描述
Demo Board User Manual

73S8023C-DB 技术参数

生命周期:Transferred包装说明:5 X 5 MM, LEAD FREE, QFN-32
Reach Compliance Code:unknown风险等级:5.59
Is Samacsys:N模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:S-XQCC-N32长度:5 mm
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
认证状态:Not Qualified座面最大高度:0.9 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
表面贴装:YES温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD宽度:5 mm
Base Number Matches:1

73S8023C-DB 数据手册

 浏览型号73S8023C-DB的Datasheet PDF文件第1页浏览型号73S8023C-DB的Datasheet PDF文件第2页浏览型号73S8023C-DB的Datasheet PDF文件第3页浏览型号73S8023C-DB的Datasheet PDF文件第5页浏览型号73S8023C-DB的Datasheet PDF文件第6页浏览型号73S8023C-DB的Datasheet PDF文件第7页 
73S8023C Demo Board User Manual  
UM_8023C_027  
Figures  
Figure 1: 73S8023C Demo Board............................................................................................................5  
Figure 2: 73S8023C Demo Board Basic Connections ..............................................................................6  
Figure 3: 73S8023C Demo Board Connectors, Jumpers and Test Points.................................................8  
Figure 4: 73S8023C 32QFN Pinout (Top View)......................................................................................11  
Figure 5: 73S8023C Demo Board Electrical Schematic..........................................................................13  
Figure 6: 73S8023C Demo Board Top View...........................................................................................15  
Figure 7: 73S8023C Demo Board Bottom View......................................................................................15  
Figure 8: 73S8023C Demo Board Top Signal Layer...............................................................................16  
Figure 9: 73S8023C Demo Board Middle Layer 1, Ground Plane...........................................................16  
Figure 10: 73S8023C Middle Layer 2, Supply Plane ..............................................................................17  
Figure 11: 73S8023C Demo Board Bottom Signal Layer........................................................................17  
Tables  
Table 1: 73S8023C Demo Board Connector, Jumper and Test Points......................................................7  
Table 2: Recommended Operating Conditions.........................................................................................9  
Table 3: Absolute Maximum Ratings........................................................................................................9  
Table 4: 73S8023C Card Interface Pins...................................................................................................9  
Table 5: 73S8023C Miscellaneous Pins.................................................................................................10  
Table 6: 73S8023C Power and Ground Pins..........................................................................................10  
Table 7: 72S8023C Microcontroller Interface Pins..................................................................................10  
Table 8: 73S8023C Demo Board Bill of Materials...................................................................................14  
Table 9: Order Numbers and Packaging Marks......................................................................................18  
4
Rev. 1.3  

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