Datasheet > 信号电路 > 其他模拟IC> 73S8009R-IMR/F

73S8009R-IMR/F

更新时间： 2024-02-15 23:55:27

品牌	Logo	应用领域
TERIDIAN		模拟IC 信号电路 PC
页数	文件大小	规格书
23页	337K
描述
Low Cost Versatile Smart Card Interface

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73S8009R-IMR/F 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Obsolete	零件包装代码：	QFN
包装说明：	4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, QFN-20	针数：	20
Reach Compliance Code：	not_compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.64
Samacsys Confidence：		Samacsys Status：	Released
Samacsys PartID：	599351	Samacsys Pin Count：	21
Samacsys Part Category：	Integrated Circuit	Samacsys Package Category：	Other
Samacsys Footprint Name：	QFN50P400X400X90-21N	Samacsys Released Date：	2017-01-11 21:24:41
Is Samacsys：	N	其他特性：	ALSO OPERATES WITH 5 VOLT SUPPLY
模拟集成电路 - 其他类型：	ANALOG CIRCUIT	JESD-30 代码：	S-XQCC-N20
长度：	4 mm	功能数量：	1
端子数量：	20	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	UNSPECIFIED
封装代码：	HVQCCN	封装形状：	SQUARE
封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	峰值回流温度（摄氏度）：	NOT SPECIFIED
认证状态：	Not Qualified	座面最大高度：	0.9 mm
最大供电电压 (Vsup)：	3.6 V	最小供电电压 (Vsup)：	2.7 V
表面贴装：	YES	温度等级：	INDUSTRIAL
端子形式：	NO LEAD	端子节距：	0.5 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	4 mm	Base Number Matches：	1

DS_8009R_056

73S8009R Data Sheet

Revision History

Revision

1.0

Date

Description

8/30/2005

First publication.

1.2

12/11/2007 Updated 28SO package dimensions.

Removed leaded options.

1.3

10/22/2009 Formatted to the new Teridian style.

Miscellaneous editorial changes.

Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.

Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.

All other trademarks are the property of their respective owners.

This Data Sheet is proprietary to Teridian Semiconductor Corporation (TSC) and sets forth design goals

for the described product. The data sheet is subject to change. TSC assumes no obligation regarding

future manufacture, unless agreed to in writing. If and when manufactured and sold, this product is sold

subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those

pertaining to warranty, patent infringement and limitation of liability. Teridian Semiconductor Corporation

(TSC) reserves the right to make changes in specifications at any time without notice. Accordingly, the

reader is cautioned to verify that a data sheet is current before placing orders. TSC assumes no liability

for applications assistance.

Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618

TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com

Rev. 1.3

1...20 21 2223

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