是否Rohs认证: | 符合 | 生命周期: | Active |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8536.69.40.40 | 风险等级: | 5.76 |
其他特性: | HDM | 板上安装选件: | COMPLIANT BOARDLOCK |
主体宽度: | 0.618 inch | 主体深度: | 0.461 inch |
主体长度: | 1.244 inch | 主体/外壳类型: | RECEPTACLE |
连接器类型: | BOARD CONNECTOR | 联系完成配合: | GOLD (30) |
联系完成终止: | TIN (15) | 触点性别: | MALE |
触点材料: | STAINLESS STEEL | 触点模式: | RECTANGULAR |
触点电阻: | 10 m Ω | 触点样式: | SQ PIN-SKT |
DIN 符合性: | NO | 滤波功能: | NO |
IEC 符合性: | NO | 最大插入力: | .6116 N |
绝缘电阻: | 5000000000 Ω | 绝缘体颜色: | BLACK |
绝缘体材料: | GLASS FILLED LIQUID CRYSTAL POLYMER | JESD-609代码: | e3 |
MIL 符合性: | NO | 插接触点节距: | 0.079 inch |
匹配触点行间距: | 0.079 inch | 插接信息: | MULTIPLE MATING PARTS AVAILABLE |
混合触点: | NO | 安装选项1: | GUIDE PIN |
安装选项2: | LOCKING | 安装方式: | STRAIGHT |
安装类型: | BOARD | 连接器数: | ONE |
PCB行数: | 6 | 装载的行数: | 6 |
最高工作温度: | 105 °C | 最低工作温度: | -55 °C |
选件: | GENERAL PURPOSE | PCB接触模式: | RECTANGULAR |
PCB触点行间距: | 2.0066 mm | 电镀厚度: | 30u inch |
额定电流(信号): | 1 A | 参考标准: | UL |
可靠性: | COMMERCIAL | 子类别: | Headers and Edge Type Connectors |
端子长度: | 0.138 inch | 端子节距: | 2 mm |
端接类型: | PRESS FIT | 触点总数: | 72 |
UL 易燃性代码: | 94V-0 | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
73644-2200 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
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73644-2201 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
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73644-2202 | MOLEX |
获取价格 |
2.00mm (.079) Pitch HDM® Board-to-Board Backp |
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73644-2204 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
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73644-2205 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
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73644-2206 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
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73644-2207 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
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73644-2208 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
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73644-2210 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
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73644-2212 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
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