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71V2556S133BQ PDF预览

71V2556S133BQ

更新时间: 2023-07-15 00:00:00
品牌 Logo 应用领域
艾迪悌 - IDT 时钟静态存储器内存集成电路
页数 文件大小 规格书
28页 3456K
描述
ZBT SRAM, 128KX36, 4.2ns, CMOS, PBGA165, 13 X 15 MM, FPBGA-165

71V2556S133BQ 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:13 X 15 MM, FPBGA-165
针数:165Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.71最长访问时间:4.2 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B165
JESD-609代码:e0长度:15 mm
内存密度:4718592 bit内存集成电路类型:ZBT SRAM
内存宽度:36湿度敏感等级:3
功能数量:1端子数量:165
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):225
电源:2.5,3.3 V认证状态:Not Qualified
座面最大高度:1.2 mm最大待机电流:0.04 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.3 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn63Pb37)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:20
宽度:13 mmBase Number Matches:1

71V2556S133BQ 数据手册

 浏览型号71V2556S133BQ的Datasheet PDF文件第2页浏览型号71V2556S133BQ的Datasheet PDF文件第3页浏览型号71V2556S133BQ的Datasheet PDF文件第4页浏览型号71V2556S133BQ的Datasheet PDF文件第5页浏览型号71V2556S133BQ的Datasheet PDF文件第6页浏览型号71V2556S133BQ的Datasheet PDF文件第7页 
128K x 36, 256K x 18  
3.3V Synchronous ZBT™ SRAMs  
2.5V I/O, Burst Counter  
Pipelined Outputs  
IDT71V2556S/XS  
IDT71V2558S/XS  
IDT71V2556SA/XSA  
IDT71V2558SA/XSA  
Features  
cycle, andtwocycleslatertheassociateddatacycleoccurs, beitread  
or write.  
The IDT71V2556/58 contain data I/O, address and control signal  
registers.Outputenableistheonlyasynchronoussignalandcanbeused  
todisabletheoutputsatanygiventime.  
AClockEnable(CEN)pinallowsoperationoftheIDT71V2556/58to  
besuspendedaslongasnecessary.Allsynchronousinputsareignored  
when(CEN)ishighandtheinternaldeviceregisterswillholdtheirprevious  
values.  
Therearethreechipenablepins(CE1,CE2,CE2)thatallowtheuser  
to deselect the device when desired. If any one of these three are not  
assertedwhenADV/LDislow,nonewmemoryoperationcanbeinitiated.  
However,anypendingdatatransfers(readsorwrites)willbecompleted.  
Thedatabuswilltri-statetwocyclesafterchipisdeselectedorawriteis  
initiated.  
TheIDT71V2556/58hasanon-chipburstcounter.Intheburstmode,  
theIDT71V2556/58canprovidefourcyclesofdataforasingleaddress  
presentedtotheSRAM.Theorderoftheburstsequenceisdefinedbythe  
LBOinputpin.TheLBOpinselectsbetweenlinearandinterleavedburst  
sequence. The ADV/LD signal is used to load a new external address  
(ADV/LD = LOW) or increment the internal burst counter (ADV/LD =  
HIGH).  
The IDT71V2556/58 SRAMs utilize IDT's latest high-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-pinthinplasticquadflatpack(TQFP)aswellasa119ballgridarray  
(BGA) and a 165 fine pitch ball grid array (fBGA).  
128K x 36, 256K x 18 memory configurations  
Supports high performance system speed - 200 MHz  
(3.2 ns Clock-to-Data Access)  
ZBTTM Feature - No dead cycles between write and read  
cycles  
Internally synchronized output buffer enable eliminates the  
need to control OE  
Single R/W (READ/WRITE) control pin  
Positive clock-edge triggered address, data, and control  
signal registers for fully pipelined applications  
4-word burst capability (interleaved or linear)  
Individual byte write (BW1 - BW4) control (May tie active)  
Three chip enables for simple depth expansion  
3.3V power supply (±5%), 2.5V I/O Supply (VDDQ)  
Optional - Boundary Scan JTAG Interface (IEEE 1149.1  
complaint)  
Packaged in a JEDEC standard 100-pin plastic thin quad  
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch  
ball grid array (fBGA)  
Description  
TheIDT71V2556/58 are3.3Vhigh-speed4,718,592-bit(4.5Mega-  
bit)synchronousSRAMS.Theyaredesignedtoeliminatedeadbuscycles  
when turning the bus around between reads and writes, or writes and  
reads. Thus, they have been given the name ZBTTM, or Zero Bus  
Turnaround.  
AddressandcontrolsignalsareappliedtotheSRAMduringoneclock  
PinDescriptionSummary  
A
0-A17  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enables  
CE1, CE  
2
, CE  
2
Output Enable  
OE  
R/W  
Read/Write Signal  
Clock Enable  
CEN  
Individual Byte Write Selects  
Clock  
BW  
1
, BW  
2
, BW  
3
, BW  
4
CLK  
ADV/LD  
LBO  
TMS  
TDI  
Advance burst address / Load new address  
Linear / Interleaved Burst Order  
Test Mode Select  
Test Data Input  
Synchronous  
Static  
Synchronous  
Synchronous  
N/A  
TCK  
Test Clock  
TDO  
TRST  
ZZ  
Test Data Output  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Static  
JTAG Reset (Optional)  
Sleep Mode  
I/O  
0
-I/O31, I/OP1-I/OP4  
Data Input / Output  
Core Power, I/O Power  
Ground  
V
V
DD, VDDQ  
SS  
Supply  
Supply  
Static  
OCTOBER428750tbl 001 8  
1
©2007IntegratedDeviceTechnology,Inc.  
DSC-4875/09  

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