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71M6603-IL/F PDF预览

71M6603-IL/F

更新时间: 2024-02-08 08:20:05
品牌 Logo 应用领域
美信 - MAXIM 模拟IC传感器信号电路光电二极管
页数 文件大小 规格书
19页 337K
描述
Isolated Sensor ICs

71M6603-IL/F 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:SOIC
包装说明:SOP, SOP8,.25针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.64
Is Samacsys:N模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-PDSO-G8长度:4.93 mm
湿度敏感等级:1功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:3/3.3 V
认证状态:Not Qualified座面最大高度:1.73 mm
子类别:Other Analog ICs最大供电电流 (Isup):1.05 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.5 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:3.94 mm
Base Number Matches:1

71M6603-IL/F 数据手册

 浏览型号71M6603-IL/F的Datasheet PDF文件第13页浏览型号71M6603-IL/F的Datasheet PDF文件第14页浏览型号71M6603-IL/F的Datasheet PDF文件第15页浏览型号71M6603-IL/F的Datasheet PDF文件第17页浏览型号71M6603-IL/F的Datasheet PDF文件第18页浏览型号71M6603-IL/F的Datasheet PDF文件第19页 
71M6xxx Data Sheet  
4.6  
Package Outline Drawing  
Controlling dimensions are in mm.  
10  
9
2.465  
PARTING  
LINE  
5°  
+3°  
-5°  
5.99  
+0.21  
-0.05  
1.97  
COO  
0.64  
5
+0.25  
-0.23  
DETAIL A  
BOTTOM VIEW  
TOP VIEW  
0.41  
+0.08  
-0.06  
SEE  
DETAIL A  
1.27 BSC  
0.33  
±0.08  
x 45°  
1.47  
+0.08  
-0.07  
8
1.63 +0.10 -0.08  
3
4.93 -0.13  
3.94  
+0.05  
-0.13  
4
0.20  
+0.05  
-0.01  
+0.05  
0.15  
4
SEATING  
PLANE  
+0.1 -  
0.023  
SIDE VIEW  
NOTES:  
END VIEW  
3
4
REFERENCE DATUM  
LENGTH AND WIDTH ARE REFERENCE DATUMS AND DO NOT  
INCLUDE MOLD FLASH OR PROTRUSIONS, BUT INCLUDE MOLD  
MISMATCH. MEASURED AT THE MOLD PARTING LINE.  
PROTRUSIONS DO NOT EXCEED 0.1524 mm AT END AND 0.254  
mm AT WINDOW.  
5
8
LENGTH OF TERMINAL FOR SOLDERING TO SUBSTRATE  
FORMED LEADS ARE PLANAR WITH RESPECT TO EACH OTHER  
WITHIN 0.735 mm AT SEATING PLANE.  
9
THE APPEARANCE OF PIN #1 I.D. IS OPTIONAL.  
COUNTRY OF ORIGIN LOCATION ON PACKAGE BOTTOM IS  
OPTIONAL AND DEPENDS ON ASSEMBLY LOCATION.  
10  
PACKAGE IS COMPLIANT WITH JEDEC STANDARD MS-012.  
DIMENSIONING AND TOLERANCES PER ANSI Y14.5 M - 1982  
Figure 8: SOIC-8 Package Outline  
16  
 
 

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