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5962F9671001VXC PDF预览

5962F9671001VXC

更新时间: 2024-02-06 11:45:28
品牌 Logo 应用领域
英特矽尔 - INTERSIL 驱动器
页数 文件大小 规格书
3页 236K
描述
Radiation Hardened Octal Buffer/ Line Driver Three-State

5962F9671001VXC 技术参数

生命周期:Obsolete零件包装代码:DFP
包装说明:DFP,针数:20
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.28系列:AC
JESD-30 代码:R-CDFP-F20JESD-609代码:e4
逻辑集成电路类型:BUS DRIVER位数:8
功能数量:1端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK传播延迟(tpd):14 ns
认证状态:Not Qualified筛选级别:MIL-PRF-38535 Class V
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子面层:GOLD端子形式:FLAT
端子位置:DUAL总剂量:300k Rad(Si) V
Base Number Matches:1

5962F9671001VXC 数据手册

 浏览型号5962F9671001VXC的Datasheet PDF文件第1页浏览型号5962F9671001VXC的Datasheet PDF文件第2页 
ACS541MS  
Die Characteristics  
DIE DIMENSIONS:  
102 mils x 102 mils  
2,600mm x 2,600mm  
METALLIZATION:  
Type: AlSi  
Metal 1 Thickness: 7.125kÅ ±1.125kÅ  
Metal 2 Thickness: 9kÅ ±1kÅ  
GLASSIVATION:  
Type: SiO2  
Thickness: 8kÅ ±1kÅ  
WORST CASE CURRENT DENSITY:  
<2.0 x 105 A/cm2  
BOND PAD SIZE:  
> 4.3 mils x 4.3 mils  
> 110µm x 110µm  
Metallization Mask Layout  
ACS541MS  
(17) Y1  
A2 (4)  
A3 (5)  
NC  
(16) Y2  
NC  
NC  
NC  
(15) Y3  
A4 (6)  
A5 (7)  
(14) Y4  
Spec Number 518856  
3

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