5秒后页面跳转
5962F9670301VCX PDF预览

5962F9670301VCX

更新时间: 2024-02-09 04:06:46
品牌 Logo 应用领域
瑞萨 - RENESAS 输入元件
页数 文件大小 规格书
4页 84K
描述
AC SERIES, QUAD 2-INPUT NAND GATE, CDIP14, SIDE BRAZED, CERAMIC, DIP-14

5962F9670301VCX 技术参数

生命周期:Transferred包装说明:,
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.62系列:AC
JESD-30 代码:R-CDIP-T14逻辑集成电路类型:NAND GATE
功能数量:4输入次数:2
端子数量:14最高工作温度:125 °C
最低工作温度:-55 °C输出特性:OPEN-DRAIN
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:IN-LINE认证状态:Not Qualified
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子形式:THROUGH-HOLE端子位置:DUAL
总剂量:300k Rad(Si) VBase Number Matches:1

5962F9670301VCX 数据手册

 浏览型号5962F9670301VCX的Datasheet PDF文件第1页浏览型号5962F9670301VCX的Datasheet PDF文件第2页浏览型号5962F9670301VCX的Datasheet PDF文件第4页 
ACS03MS  
Die Characteristics  
DIE DIMENSIONS:  
68 mils x 79 mils  
1730mm x 2010mm  
METALLIZATION:  
Type: AlSi  
Metal 1 Thickness: 7.125kÅ ±1.125kÅ  
Metal 2 Thickness: 9kÅ ±1kÅ  
GLASSIVATION:  
Type: SiO2  
Thickness: 8kÅ ±1kÅ  
WORST CASE CURRENT DENSITY:  
<2.0 x 105A/cm2  
BOND PAD SIZE:  
110µm x 110µm  
4.3 mils x 4.3 mils  
Metallization Mask Layout  
ACS03MS  
VCC  
(14)  
B1  
(2)  
A1  
(1)  
B4  
(13)  
Y1 (3)  
(12) A4  
(11) Y4  
A2 (4)  
B2 (5)  
(10) B3  
Y2 (6)  
(9) A3  
(7)  
GND  
(8)  
Y3  
Spec Number 518779  
3

与5962F9670301VCX相关器件

型号 品牌 描述 获取价格 数据表
5962F9670301VXC INTERSIL Radiation Hardened Quad 2-Input NAND Gate with Open Drain

获取价格

5962F9670301VXX RENESAS AC SERIES, QUAD 2-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14

获取价格

5962F9670302VCC ETC Quad 2-input NAND Gate

获取价格

5962F9670302VXC ETC Quad 2-input NAND Gate

获取价格

5962F9670302VXX WEDC NAND Gate, AC Series, 4-Func, 2-Input, CMOS, CDFP14, CERAMIC, DFP-14

获取价格

5962F9670401VEC INTERSIL Radiation Hardened Dual J-K Flip-Flop

获取价格