1.3 Absolute maximum ratings. 2/
3.3 V DC supply voltage range (VCCA, and VCCI ).......................................... -0.3 V dc to +4.0 V dc
5.0 V DC supply voltage range (VCCR).......................................................... -0.3 V dc to +6.0 V dc
Input voltage range (VI) ................................................................................ -0.5 V dc to +5.5 V dc
Output voltage range (VO) ............................................................................ -0.5 V dc to +3.6 V dc
I/O source sink current (IIO) .......................................................................... -30 to +5.0 mA
Storage temperature range (TSTG)................................................................ -40 C to +125 C
Lead temperature (soldering, 10 seconds)................................................... 300 C
Thermal resistance, junction-to-case ( JC):
Case X........................................................................................................ 8 C/W 3/
Case Y........................................................................................................ 9 C/W 3/
Maximum junction temperature (TJ).............................................................. +150 C
1.4 Recommended operating conditions.
10% VCC
)
3.3V Power supply (VCCA, and VCCI) ............................................................. +3.0 V dc to +3.6 V dc (
5.0V Power supply (VCCR)............................................................................. +4.5 V dc to +5.5 V dc ( 10% VCC
)
Case operating temperature range (TC) ....................................................... -55 C to +125 C
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012)............................................. 100 percent 4/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value indicated
herein.
4/ 100 percent test coverage of blank programmable logic devices.
SIZE
STANDARD
5962-99586
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
3
DSCC FORM 2234
APR 97