Datasheet > 5962-9866102VYC

5962-9866102VYC

更新时间： 2024-01-24 07:06:17

品牌	Logo	应用领域
德州仪器 - TI		外围集成电路数字信号处理器时钟
页数	文件大小	规格书
60页	791K
描述
RAD-TOLERANT CLASS-V FLOATING-POINT DIGITAL SIGNAL PROCESSOR

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5962-9866102VYC 技术参数

生命周期：	Active	零件包装代码：	LGA
包装说明：	LGA, LGA429,21X21,50	针数：	429
Reach Compliance Code：	not_compliant	ECCN代码：	3A001.A.3
HTS代码：	8542.31.00.01	风险等级：	5.5
其他特性：	-55 TO 115 OPERATING CASE TEMPERATURE	地址总线宽度：	22
桶式移位器：	NO	位大小：	32
边界扫描：	YES	最大时钟频率：	140.84 MHz
外部数据总线宽度：	32	格式：	FLOATING POINT
集成缓存：	YES	内部总线架构：	MULTIPLE
JESD-30 代码：	S-CBGA-N429	长度：	27 mm
低功率模式：	YES	DMA 通道数量：	4
外部中断装置数量：	4	端子数量：	429
计时器数量：	2	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装主体材料：	CERAMIC, METAL-SEALED COFIRED
封装代码：	LGA	封装等效代码：	LGA429,21X21,50
封装形状：	SQUARE	封装形式：	GRID ARRAY
峰值回流温度（摄氏度）：	NOT SPECIFIED	电源：	1.9,3.3 V
认证状态：	Qualified	RAM（字数）：	16384
筛选级别：	MIL-PRF-38535 Class V	座面最大高度：	2.52 mm
子类别：	Digital Signal Processors	最大供电电压：	1.99 V
最小供电电压：	1.81 V	标称供电电压：	1.9 V
表面贴装：	YES	技术：	CMOS
温度等级：	MILITARY	端子形式：	NO LEAD
端子节距：	1.27 mm	端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	27 mm
uPs/uCs/外围集成电路类型：	DIGITAL SIGNAL PROCESSOR, OTHER	Base Number Matches：	1

5962-9866102VYC 数据手册

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2009

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

5962-9866101VXA

5962-9866102VXA

5962-9866102VYC

ACTIVE

CFCBGA

FCLGA

GLP

429

TBD

Call TI

N / A for Pkg Type

GLP

ZMB

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SMJ320C6701-SP :

Catalog: SMJ320C6701

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Addendum-Page 1

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与5962-9866102VYC相关器件

型号	品牌	描述	获取价格	数据表
5962-9875901QXC	ACTEL	Field Programmable Gate Array, 1362 CLBs, 10000 Gates, CMOS, CQFP84, CERAMIC, QFP-84	获取价格
5962-9875901QXX	ACTEL	Field Programmable Gate Array, 1362 CLBs, 10000 Gates, CMOS, CQFP84, CERAMIC, QFP-84	获取价格
5962-98A0101QXC	WEDC	Field Programmable Gate Array	获取价格
5962-98A0201QXC	WEDC	Field Programmable Gate Array	获取价格
5962-98A0201QXX	AMI	Field Programmable Gate Array,	获取价格
5962-98A0301QXX	WEDC	Field Programmable Gate Array	获取价格

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