生命周期: | Obsolete | Reach Compliance Code: | unknown |
风险等级: | 5.84 | Is Samacsys: | N |
其他特性: | 512K X 16 FLASH IS ALSO AVAILABLE | JESD-30 代码: | S-CQFP-G68 |
JESD-609代码: | e0 | 内存密度: | 8388608 bit |
内存集成电路类型: | MEMORY CIRCUIT | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 68 |
字数: | 524288 words | 字数代码: | 512000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 512KX16 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装形状: | SQUARE |
封装形式: | FLATPACK | 认证状态: | Not Qualified |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | TIN LEAD | 端子形式: | GULL WING |
端子位置: | QUAD | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
5962-9690101HMC | WEDC | Memory Circuit, Flash+SRAM, 512KX8, CMOS, CDSO68, CERAMIC, QFP-68 |
获取价格 |
|
5962-9690101HMX | WEDC | Memory Circuit, 512KX16, CMOS, CQFP68, 0.880 X 0.880 INCH, HERMETIC SEALED, CERAMIC, QFP-6 |
获取价格 |
|
5962-9690101HXA | WEDC | Memory Circuit, Flash+SRAM, 512KX8, CMOS, PGA-66 |
获取价格 |
|
5962-9690101HXC | WEDC | Memory Circuit, Flash+SRAM, 512KX8, CMOS, PGA-66 |
获取价格 |
|
5962-9690101HXX | WEDC | Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERA |
获取价格 |
|
5962-9690102HMA | WEDC | Memory Circuit, Flash+SRAM, 512KX8, CMOS, CDSO68, CERAMIC, QFP-68 |
获取价格 |