WE32K32-XXX
White Electronic Designs
ORDERING INFORMATION
W E 32K32 X - XXX X X X
WHITE ELECTRONIC DESIGNS CORPꢀ
EEPROM
ORGANIZATION, 32K x 32
User Configurable as 64Kx16 or 128Kx8
IMPROVEMENT MARK
N = No Connect at pins 8, 21, 28, and 39 in HIP for upgrade
ACCESS TIME (ns)
PACKAGE TYPE:
H1 = Ceramic Hex In-line Package, HIP (Package 400)
G2U = 22%4mm Ceramic Quad Flat Pack, CQFP Low Profile (Package 510)
G1U1 = 23%9mm Ceramic Quad Flat Pack, CQFP Low Profile (Package 519)
G1T = 23%9mm Ceramic Quad Flat Pack, CQFP (Package 524)
DEVICE GRADE:
Q
M
I
=
=
=
=
MIL-STD-883 Compliant
Military Screened
Industrial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
C
Commercial
LEAD FINISH:
Blank = Gold plated leads
A
=
Solder dip leads
NOTE 1: Package not recommended for new design
DEVICE TYPE
SPEED
PACKAGE
SMD NOꢀ
32K x 32 EEPROM Module
32K x 32 EEPROM Module
32K x 32 EEPROM Module
150ns
120ns
90ns
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
5962-94614 01HXX
5962-94614 02HXX
5962-94614 03HXX
32K x 32 EEPROM Module
32K x 32 EEPROM Module
32K x 32 EEPROM Module
150ns
120ns
90ns
68 lead CQFP/J (G2U)
68 lead CQFP/J (G2U)
68 lead CQFP/J (G2U)
5962-94614 01HZX
5962-94614 02HZX
5962-94614 03HZX
1
1
32K x 32 EEPROM Module
32K x 32 EEPROM Module
32K x 32 EEPROM Module
150ns
120ns
90ns
68 lead CQFP/J (G1U)
68 lead CQFP/J (G1U)
68 lead CQFP/J (G1U)
5962-94614 01H9X
5962-94614 02H9X
5962-94614 03H9X
1
1
1
1
NOTE 1: Package not recommended for new design
WhiteElectronicDesignsCorporationPhoenix,AZ(602)437-1520
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