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5962-9461402H9C PDF预览

5962-9461402H9C

更新时间： 2024-01-09 21:07:42
品牌 Logo 应用领域
其他 - ETC 内存集成电路可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
30页 177K
描述
EEPROM

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5962-9461402H9C 技术参数

生命周期：Transferred零件包装代码：QFP
包装说明：QFP,针数：68
Reach Compliance Code：unknownECCN代码：3A001.A.2.C
HTS代码：8542.32.00.51风险等级：5.28
Is Samacsys：N最长访问时间：120 ns
其他特性：CONFIGURABLE AS 128K X 8备用内存宽度：16
JESD-30 代码：S-CQFP-G68JESD-609代码：e4
长度：22.36 mm内存密度：1048576 bit
内存集成电路类型：EEPROM MODULE内存宽度：32
功能数量：1端子数量：68
字数：32768 words字数代码：32000
工作模式：ASYNCHRONOUS最高工作温度：125 °C
最低工作温度：-55 °C组织：32KX32
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装代码：QFP
封装形状：SQUARE封装形式：FLATPACK
并行/串行：PARALLEL编程电压：5 V
认证状态：Not Qualified筛选级别：MIL-STD-883
座面最大高度：3.51 mm最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：4.5 V标称供电电压 (Vsup)：5 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子面层：GOLD
端子形式：GULL WING端子位置：QUAD
宽度：22.36 mmBase Number Matches：1

5962-9461402H9C 数据手册

 浏览型号5962-9461402H9C的Datasheet PDF文件第1页浏览型号5962-9461402H9C的Datasheet PDF文件第3页浏览型号5962-9461402H9C的Datasheet PDF文件第4页浏览型号5962-9461402H9C的Datasheet PDF文件第5页浏览型号5962-9461402H9C的Datasheet PDF文件第6页浏览型号5962-9461402H9C的Datasheet PDF文件第7页 
1. SCOPE  
1.1 Scope. This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G  
(lowered high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes  
which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness  
assurance levels are reflected in the PIN.  
1.2 PIN. The PIN shall be as shown in the following example:  
5962  
-
94614  
01  
H
M
X
½
½
½
½
½
½
½
½
½
½
½
½
½
½
½
½
½
½
Federal  
stock class  
designator  
RHA  
designator  
(see 1.2.1)  
Device  
type  
(see 1.2.2)  
Device  
class  
designator  
(see 1.2.3)  
Case  
outline  
(see 1.2.4)  
Lead  
finish  
(see 1.2.5)  
\
/
\/  
Drawing number  
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA  
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.  
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:  
Device type  
Generic number  
Circuit function  
Access time  
01  
02  
03  
WE32K32-150Q, AS8E32K32Q-150/883C  
WE32K32-120Q, AS8E32K32Q-120/883C  
WE32K32-90Q, AS8E32K32Q-90/883C  
EEPROM, 32K x 32-bit  
EEPROM, 32K x 32-bit  
EEPROM, 32K x 32-bit  
150 ns  
120 ns  
90 ns  
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level as  
follows:  
Device class  
Device performance documentation  
D, E, G, H, or K  
Certification and qualification to MIL-PRF-38534  
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
M
U
X
Y 1/  
Z
See figure 1  
See figure 1  
See figure 1  
See figure 1  
See figure 1  
68  
66  
66  
66  
68  
Ceramic, dual cavity, quad flatpack  
1.075", hex-in-line, single cavity, with standoffs  
Hex-in-line, single cavity, with standoffs  
Hex-in-line, single cavity, without standoffs  
Co-fired ceramic, single cavity, ultra low profile,  
quad flatpack  
9
See figure 1  
68  
Co-fired ceramic, single cavity, quad flatpack  
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.  
1/ The case outline Y is inactive for new design.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
5962-94614  
A
REVISION LEVEL  
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
D
2
DSCC FORM 2234  
APR 97  
1234567...30

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