1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix
A for device class M.
1.3 Absolute maximum ratings. 1/
Endurance:
Device types 01-04, 09 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 cycles/byte, minimum
Device types 05-08 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1,000 cycles/byte, minimum
Device types 10-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100,000 cycles/byte, minimum
Supply voltage range (V ) 2/ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0 V dc to +7.0 V dc
CC
Storage temperature range (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 C to +150 C
stg
Maximum power dissipation (P ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W
D
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . +300 C
Junction temperature (T ) 3/ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
J
Thermal resistance, junction-to-case (
Thermal resistance, junction-to-case (
Thermal resistance, junction-to-case (
) (case outline X, Y) . . . . . . See MIL-STD-1835
) (case outlines T, Z) . . . . . . 13 C/W
) (case outline U) . . . . . . . . . 27 C/W
JC
JC
JC
Voltage on any pin with respect to ground 2/ . . . . . . . . . . . . . . . . . . . . . -2.0 V dc to +7.0 V dc
Voltage on pin A with respect to ground 4/ . . . . . . . . . . . . . . . . . . . . . -2.0 V dc to +13.5 V dc
9
V
V
supply voltage with respect to ground 4/ . . . . . . . . . . . . . . . . . . . . -2.0 V dc to +14.0 V dc
supply voltage with respect to ground 2/ . . . . . . . . . . . . . . . . . . . . -2.0 V dc to +7.0 V dc
PP
CC
Output short circuit current 5/ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 years minimum
1.4 Recommended operating conditions. 6/
Supply voltage range (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc
CC
Operating temperature range (T
Low level input voltage range (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V dc to +0.8 V dc
High level input voltage range (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +2.0 V dc to V
High level input voltage range, CMOS (V ) . . . . . . . . . . . . . . . . . . . . . . V
) . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 C to +125 C
case
IL
IH
+0.5 V dc
CC
-0.5 V dc to V
+0.5 V dc
IH
CC
CC
Chip clear (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.4 V dc to 12.6 V dc
P
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . . . . . . 100 percent
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Minimum dc voltage on input or V pins is -0.5 V. During voltage transitions, inputs may overshoot V
to -2.0 V for
O
SS
periods of up to 20 ns. Maximum dc voltage on output and V pins is V
+0.5 V. During voltage transitions outputs
O
CC
may overshoot to V
+2.0 V for periods up to 20 ns.
CC
3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
4/ Minimum dc input voltage on A or V
may overshoot to +14.0 V for periods less than 20 ns.
9
PP
5/ No more than one output shorted at a time. Duration of short circuit should not be greater than 1 second.
6/ All voltages are referenced to V (ground).
SS
SIZE
STANDARD
5962-90899
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
C
SHEET
3
DSCC FORM 2234
APR 97