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5962-8979805TC PDF预览

5962-8979805TC

更新时间: 2024-01-09 21:04:53
品牌 Logo 应用领域
其他 - ETC 外围集成电路数据传输控制器通信时钟
页数 文件大小 规格书
26页 162K
描述
Controller Miscellaneous - Datasheet Reference

5962-8979805TC 技术参数

生命周期:Obsolete包装说明:DFP,
Reach Compliance Code:unknownHTS代码:8542.31.00.01
风险等级:5.83Is Samacsys:N
地址总线宽度:11边界扫描:NO
最大时钟频率:16 MHz通信协议:MIL STD 1553
数据编码/解码方法:BIPH-LEVEL(MANCHESTER)最大数据传输速率:0.125 MBps
外部数据总线宽度:16JESD-30 代码:R-CDFP-F78
JESD-609代码:e4低功率模式:NO
串行 I/O 数:2端子数量:78
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:DFP
封装形状:RECTANGULAR封装形式:FLATPACK
认证状态:Not Qualified筛选级别:MIL-PRF-38534
座面最大高度:5.33 mm最大供电电压:5.25 V
最小供电电压:4.75 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:GOLD
端子形式:FLAT端子节距:1.27 mm
端子位置:DUALuPs/uCs/外围集成电路类型:SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches:1

5962-8979805TC 数据手册

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1. SCOPE  
1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with  
MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying  
Number (PIN).  
1.2 PIN. The PIN shall be as shown in the following example:  
5962-89798  
01  
X
X
Drawing number  
Device type  
(see 1.2.1)  
Case outline  
(see 1.2.2)  
Lead finish  
(see 1.2.3)  
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:  
Device type  
Generic number  
Circuit function  
01  
02  
03  
04  
05  
06  
07  
BUS65142, BUS65144  
BUS65143, BUS65145  
CT2542, CT2542-FP  
CT2543, CT2543-FP  
BU-65142X1  
Dual redundant remote terminal unit (RTU)  
Dual redundant remote terminal unit (RTU)  
Dual redundant remote terminal unit (RTU)  
Dual redundant remote terminal unit (RTU)  
Dual redundant remote terminal unit (RTU), +5/-15 V transceiver  
Dual redundant remote terminal unit (RTU), +5/-12 V transceiver  
Dual redundant remote terminal unit (RTU), +5/+5 V transceiver  
BU-65142X2  
BU-65142X3  
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
T
X
Y
Z
See figure 1  
See figure 1  
See figure 1  
See figure 1  
78  
78  
82  
78  
Dual-in-line, ceramic, staggered pins  
Dual-in-line, staggered pins  
Flat pack  
Flat pack  
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.  
1.3 Absolute maximum ratings. 1/  
Logic supply voltage (VL)...........................................................  
Negative supply voltage (VEE) ...................................................  
Storage temperature .................................................................  
Thermal rise, case to junction(TJ)............................................  
Lead temperature (soldering, 10 seconds)................................  
Power dissipation (TC = +125°C)...............................................  
5.5 V dc  
-18.0 V dc  
-65°C to +150°C  
13.9°C  
+300°C  
Duty cycle dependent (see table I power supplies)  
1.4 Recommended operating conditions.  
Logic supply voltage (VL):  
Device types 01 through 04 ...................................................  
Device types 05 through 07 ...................................................  
Negative supply voltage (VEE):  
+4.5 V dc to +5.5 V dc  
+4.75 V dc to +5.25 V dc  
Device types 01, 03, and 05 ..................................................  
Device types 02, 04, and 06 ..................................................  
Maximum differential input voltage .............................................  
Case operating temperature range (TC)......................................  
-14.25 V dc to -15.75 V dc  
-11.4 V dc to -12.6 V dc  
40 Vp-p  
-55°C to +125°C  
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the  
maximum levels may degrade performance and affect reliability.  
SIZE  
STANDARD  
5962-89798  
A
MICROCIRCUIT DRAWING  
REVISION LEVEL  
F
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
2
DSCC FORM 2234  
APR 97  

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