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5962-8946302XC PDF预览

5962-8946302XC

更新时间： 2024-01-12 11:47:39
品牌 Logo 应用领域
爱特美尔 - ATMEL 外围集成电路
页数 文件大小 规格书
43页 1238K
描述
Math Coprocessor, CMOS, CPGA68, CERAMIC, PGA-68

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中文翻译

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5962-8946302XC 技术参数

是否Rohs认证： 不符合生命周期：Transferred
零件包装代码：PGA包装说明：PGA, PGA68,10X10
针数：68Reach Compliance Code：unknown
ECCN代码：3A001.A.2.CHTS代码：8542.31.00.01
风险等级：5.07JESD-30 代码：S-CPGA-P68
JESD-609代码：e4长度：26.92 mm
端子数量：68最高工作温度：125 °C
最低工作温度：-55 °C封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装代码：PGA封装等效代码：PGA68,10X10
封装形状：SQUARE封装形式：GRID ARRAY
电源：5 V认证状态：Not Qualified
筛选级别：MIL-STD-883座面最大高度：4.82 mm
子类别：Math Processors最大压摆率：150 mA
最大供电电压：5.5 V最小供电电压：4.5 V
标称供电电压：5 V表面贴装：NO
技术：CMOS温度等级：MILITARY
端子面层：Gold (Au)端子形式：PIN/PEG
端子节距：2.54 mm端子位置：PERPENDICULAR
宽度：26.92 mmuPs/uCs/外围集成电路类型：MATH PROCESSOR, COPROCESSOR
Base Number Matches：1

5962-8946302XC 数据手册

 浏览型号5962-8946302XC的Datasheet PDF文件第5页浏览型号5962-8946302XC的Datasheet PDF文件第6页浏览型号5962-8946302XC的Datasheet PDF文件第7页浏览型号5962-8946302XC的Datasheet PDF文件第9页浏览型号5962-8946302XC的Datasheet PDF文件第10页浏览型号5962-8946302XC的Datasheet PDF文件第11页 
Thermal  
Characteristics  
Table 4.  
Package  
Symbol  
θJA  
Parameter  
Value  
33  
4
Rating  
°C/W  
°C/W  
°C/W  
°C/W  
Thermal Resistance - Ceramic Junction To Ambient  
Thermal Resistance - Ceramic Junction To Case  
Thermal Resistance - Ceramic Junction To Ambient  
Thermal Resistance - Ceramic Junction To Case  
PGA 68  
θJC  
θJA  
33  
3
CQFP  
θJC  
Power  
The average chip-junction temperature, TJ, in °C can be obtained from:  
Considerations  
TJ = TA + (PD + θJA)  
(1)  
TA = Ambient Temperature, °C  
θJA = Package Thermal Resistance, Junction-to-Ambient, °C/W  
PD = PINT + PI/O  
PINT = ICC x VCC, Watts - Chip Internal Power  
PI/O = Power Dissipation on Input and Output Pins - User Determined  
For most applications PI/O < PINT and can be neglected.  
An Approximate relationship between PD and TJ (if PI/O is neglected) is:  
PD = K: (TJ + 273)  
(2)  
Solving equations (1) and (2) for K gives  
2
K = PD. (TA + 273) + θJA · PD  
(3)  
where K is constant pertaining to the particular part K can be determined from the equa-  
tion (3) by measuring PD (at equilibrium) for a known TA. Using this value of K, the  
values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any  
value of TA.  
The total thermal resistance of a package (θJA) can be separated into two components,  
θ
JC and θCA, representing the barrier to heat flow from the semiconductor junction to the  
package (case), surface (θJC) and from the case to the outside ambient (θCA). These  
terms are related by the equation:  
θJA = θJC + θCA  
(4)  
θJA is device related and cannot be influenced by the user. However, θCA is user depen-  
dent and can be minimized by such thermal management techniques as heat sinks,  
ambient air cooling and thermal convection. Thus, good thermal management on the  
part of the user can significantly reduce θCA so that θJA approximately equals θJC. Substi-  
tution of θJC for θJA in equation (1) will result in a lower semiconductor junction  
temperature.  
8
TS68882  
2119A–HIREL–04/02  
1...567891011...43

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5962-8946302XX ATMEL

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5962-8946302YC ATMEL

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5962-8946302YX ATMEL

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5962-8946303XA ATMEL

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5962-8946303XC ATMEL

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 		Math Coprocessor, CMOS, CPGA68, CERAMIC, PGA-68
5962-8946303XX ATMEL

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 		Floating Point Processor, 33-Bit, CMOS, CPGA68
5962-8946303YA ATMEL

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5962-8946303YC ATMEL

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5962-8946303YX ATMEL

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 		Floating Point Processor, 33-Bit, CMOS, CQFP68
5962-8946304XA ATMEL

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 		Math Coprocessor, CMOS, CPGA68, CERAMIC, PGA-68

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