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5962-8684401DA PDF预览

5962-8684401DA

更新时间： 2024-01-20 12:13:35
品牌 Logo 应用领域
德州仪器 - TI 栅极触发器逻辑集成电路输入元件
页数 文件大小 规格书
8页 119K
描述
QUADRUPLE 2-INPUT POSITIVE-NOR GATES

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5962-8684401DA 技术参数

生命周期：Obsolete包装说明：DFP,
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.7系列：ALS
JESD-30 代码：R-GDFP-F14长度：9.21 mm
逻辑集成电路类型：NOR GATE功能数量：4
输入次数：2端子数量：14
最高工作温度：125 °C最低工作温度：-55 °C
封装主体材料：CERAMIC, GLASS-SEALED封装代码：DFP
封装形状：RECTANGULAR封装形式：FLATPACK
峰值回流温度（摄氏度）：NOT SPECIFIED传播延迟（tpd）：16 ns
认证状态：Not Qualified筛选级别：MIL-STD-883
座面最大高度：2.03 mm最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：4.5 V标称供电电压 (Vsup)：5 V
表面贴装：YES技术：TTL
温度等级：MILITARY端子形式：FLAT
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：6.29 mm
Base Number Matches：1

5962-8684401DA 数据手册

 浏览型号5962-8684401DA的Datasheet PDF文件第2页浏览型号5962-8684401DA的Datasheet PDF文件第3页浏览型号5962-8684401DA的Datasheet PDF文件第4页浏览型号5962-8684401DA的Datasheet PDF文件第5页浏览型号5962-8684401DA的Datasheet PDF文件第7页浏览型号5962-8684401DA的Datasheet PDF文件第8页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
LCCC  
CFP  
Drawing  
5962-86844012A  
5962-8684401DA  
JM38510/37301B2A  
JM38510/37301BCA  
SN54ALS02AJ  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
FK  
W
FK  
J
20  
14  
20  
14  
14  
14  
14  
1
1
None  
None  
None  
None  
None  
None  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
LCCC  
CDIP  
CDIP  
CDIP  
SOIC  
1
1
J
1
SN54AS02J  
J
1
SN74ALS02AD  
D
50  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
SN74ALS02ADR  
SN74ALS02AN  
ACTIVE  
ACTIVE  
SOIC  
PDIP  
D
N
14  
14  
2500  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74ALS02AN3  
OBSOLETE  
ACTIVE  
PDIP  
SO  
N
14  
14  
None  
Call TI  
Call TI  
SN74ALS02ANSR  
NS  
2000  
50  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
SN74AS02D  
SN74AS02DR  
SN74AS02N  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
PDIP  
D
D
N
14  
14  
14  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
2500  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74AS02N3  
OBSOLETE  
ACTIVE  
PDIP  
SO  
N
14  
14  
None  
Call TI  
Call TI  
SN74AS02NSR  
NS  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
SNJ54ALS02AFK  
SNJ54ALS02AJ  
SNJ54ALS02AW  
SNJ54AS02FK  
SNJ54AS02J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
CDIP  
CFP  
FK  
J
20  
14  
14  
20  
14  
1
1
1
1
1
None  
None  
None  
None  
None  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
W
FK  
J
LCCC  
CDIP  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Addendum-Page 1  
1...345678

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