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5962-8409601VXC PDF预览

5962-8409601VXC

更新时间: 2024-02-11 09:44:15
品牌 Logo 应用领域
其他 - ETC 驱动器逻辑集成电路
页数 文件大小 规格书
17页 94K
描述
Buffer/Driver

5962-8409601VXC 技术参数

生命周期:Obsolete零件包装代码:DFP
包装说明:DFP,针数:20
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.31系列:HC/UH
JESD-30 代码:R-XDFP-F20长度:12.955 mm
逻辑集成电路类型:BUS DRIVER位数:4
功能数量:2端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:UNSPECIFIED
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK传播延迟(tpd):170 ns
认证状态:Not Qualified筛选级别:MIL-PRF-38535 Class V
座面最大高度:2.16 mm最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):4.5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:FLAT
端子节距:1.27 mm端子位置:DUAL
宽度:7.115 mmBase Number Matches:1

5962-8409601VXC 数据手册

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2. APPLICABLE DOCUMENTS  
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part  
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the  
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the  
solicitation.  
SPECIFICATION  
DEPARTMENT OF DEFENSE  
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.  
STANDARDS  
DEPARTMENT OF DEFENSE  
MIL-STD-883  
MIL-STD-1835  
-
-
Test Method Standard Microcircuits.  
Interface Standard Electronic Component Case Outlines.  
HANDBOOKS  
DEPARTMENT OF DEFENSE  
MIL-HDBK-103 - List of Standard Microcircuit Drawings.  
MIL-HDBK-780 - Standard Microcircuit Drawings.  
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization  
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)  
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of  
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific  
exemption has been obtained.  
3. REQUIREMENTS  
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with  
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The  
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for  
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified  
herein.  
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in  
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.  
3.2.1 Case outlines. The case outlines shall be in accordance with figure 1 and 1.2.4 herein.  
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.  
3.2.3 Truth table. The truth table shall be as specified on figure 3.  
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 4.  
3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified in figure 5.  
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the  
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full  
case operating temperature range.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
84096  
SHEET  
A
DEFENSE SUPPLY CENTER COLUMBUS  
REVISION LEVEL  
F
COLUMBUS, OHIO 43216-5000  
4
DSCC FORM 2234  
APR 97  

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