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5962-8409601VXC PDF预览

5962-8409601VXC

更新时间: 2024-02-13 16:09:36
品牌 Logo 应用领域
其他 - ETC 驱动器逻辑集成电路
页数 文件大小 规格书
17页 94K
描述
Buffer/Driver

5962-8409601VXC 技术参数

生命周期:Obsolete零件包装代码:DFP
包装说明:DFP,针数:20
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.31系列:HC/UH
JESD-30 代码:R-XDFP-F20长度:12.955 mm
逻辑集成电路类型:BUS DRIVER位数:4
功能数量:2端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:UNSPECIFIED
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK传播延迟(tpd):170 ns
认证状态:Not Qualified筛选级别:MIL-PRF-38535 Class V
座面最大高度:2.16 mm最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):4.5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:FLAT
端子节距:1.27 mm端子位置:DUAL
宽度:7.115 mmBase Number Matches:1

5962-8409601VXC 数据手册

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1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
R
S
X
2
GDIP1-T20 or CDIP2-T20  
GDFP2-F20 or CDFP3-F20  
See figure 1  
20  
20  
20  
20  
Dual-in-line  
Flat pack  
Flat pack  
Square leadless chip carrier  
CQCC1-N20  
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A  
for device class M.  
1.3 Absolute maximum ratings. 1/ 2/ 3/  
Supply voltage range (VCC).................................................................................. -0.5 V dc to +7.0 V dc  
DC input voltage range (VIN)................................................................................ -0.5 V dc to VCC +0.5 V dc  
DC output voltage range (VOUT)........................................................................... -0.5 V dc to VCC +0.5 V dc  
Input clamp current (IIK) (VIN < 0.0 to VIN > VCC).................................................. ±20 mA  
Output clamp current (IOK) (VOUT < 0.0 to VOUT > VCC)......................................... ±20 mA  
Continuous output current (IOUT) (VOUT = 0.0 to VCC)........................................... ±35 mA  
Continuous current through VCC or GND............................................................. ±70 mA  
Storage temperature range (TSTG)....................................................................... -65°C to +150°C  
Maximum power dissipation (PD):........................................................................ 500 mW 4/  
Lead temperature (soldering, 10 seconds).......................................................... +260°C  
Thermal resistance, junction-to-case (θJC) .......................................................... See MIL-STD-1835  
Junction temperature (TJ).................................................................................... +175°C 5/  
1.4 Recommended operating conditions. 2/ 3/  
Supply voltage range (VCC).................................................................................. +2.0 V dc to +6.0 V dc  
Case operating temperature range (TC) ............................................................. -55°C to +125°C  
Input rise or fall time (tr, tf):  
VCC = 2.0 V ........................................................................................................ 0 to 1000 ns  
VCC = 4.5 V ........................................................................................................ 0 to 500 ns  
VCC = 6.0 V ........................................................................................................ 0 to 400 ns  
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the  
maximum levels may degrade performance and affect reliability.  
2/ Unless otherwise noted, all voltages are referenced to GND.  
3/ The limits for the parameters specified herein shall apply over the full specified VCC range and case temperature range of  
-55°C to +125°C.  
4/ For TC = +100°C to +125°C, derate linearly at 12 mW/°C.  
5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in  
accordance with method 5004 of MIL-STD-883.  
SIZE  
STANDARD  
MICROCIRCUIT DRAWING  
84096  
SHEET  
A
DEFENSE SUPPLY CENTER COLUMBUS  
REVISION LEVEL  
F
COLUMBUS, OHIO 43216-5000  
3
DSCC FORM 2234  
APR 97  

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