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5962-0824502HXC PDF预览

5962-0824502HXC

更新时间: 2024-02-23 00:48:15
品牌 Logo 应用领域
MICROSS 内存集成电路
页数 文件大小 规格书
29页 363K
描述
Flash, 2MX32, 100ns, CQFP68, QFP-68

5962-0824502HXC 技术参数

生命周期:Active零件包装代码:QFP
包装说明:QFP, QFP68,.99SQ,50针数:68
Reach Compliance Code:compliantECCN代码:3A001.A.2.C
HTS代码:8542.32.00.51风险等级:5.67
Is Samacsys:N最长访问时间:100 ns
其他特性:BOTTOM BOOT BLOCK启动块:BOTTOM
命令用户界面:YES数据轮询:YES
JESD-30 代码:R-CQFP-G68长度:24.028 mm
内存密度:67108864 bit内存集成电路类型:FLASH
内存宽度:32功能数量:1
部门数/规模:1,2,1,31端子数量:68
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:2MX32
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:QFP
封装等效代码:QFP68,.99SQ,50封装形状:RECTANGULAR
封装形式:FLATPACK并行/串行:PARALLEL
电源:3.3 V编程电压:3 V
认证状态:Qualified筛选级别:MIL-STD-883
座面最大高度:3.56 mm部门规模:16K,8K,32K,64K
最大待机电流:0.00025 A子类别:Flash Memories
最大压摆率:0.14 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:GULL WING
端子节距:1.27 mm端子位置:QUAD
切换位:YES类型:NOR TYPE
宽度:22.352 mmBase Number Matches:1

5962-0824502HXC 数据手册

 浏览型号5962-0824502HXC的Datasheet PDF文件第2页浏览型号5962-0824502HXC的Datasheet PDF文件第3页浏览型号5962-0824502HXC的Datasheet PDF文件第4页浏览型号5962-0824502HXC的Datasheet PDF文件第5页浏览型号5962-0824502HXC的Datasheet PDF文件第6页浏览型号5962-0824502HXC的Datasheet PDF文件第7页 
FLASH  
AS8FLC2M32  
FIGURE 1: PIN ASSIGNMENT  
Hermetic, Multi-Chip Module  
(Top View)  
(MCM)  
64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array  
Available via Applicable Specications:  
MIL-PRF-38534, Class H  
DSCC SMD 5962-08245  
DQ0  
DQ1  
10  
11  
12  
60  
59  
78  
57  
76  
DQ16  
DQ17  
DQ18  
DQ2  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
DQ3  
DQ19  
DQ4  
DQ20  
FEATURES  
DQ5  
DQ6  
DQ7  
GND  
DQ8  
DQ9  
55  
54  
53  
DQ21  
64Mb device, total density, organized as 2M x 32  
Bottom Boot Block (Sector) Architecture  
(Contact factory for top boot)  
Operation with single 3.0V Supply  
Available in multiple Access time variations  
Individual byte control via individual byte selects (CSx\)  
Low Power CMOS  
1,000,000 Erase/Program Cycles  
Minimum 1,000,000 Program/Erase Cycles per sector  
guaranteed  
DQ22  
DQ23  
GND  
DQ24  
DQ25  
DQ26  
DQ27  
52  
51  
50  
49  
48  
47  
46  
45  
44  
DQ10  
DQ11  
Package Designator Q
DQ12  
DQ28  
DQ13  
DQ29  
DQ14  
DQ30  
DQ31  
DQ15  
Sector Architecture:  
One 16K byte, two 8K byte, one 32K byte and  
thirty-one 64Kbyte sectors (byte mode)  
Pin Assignment  
(Top View)  
I
D
Q
8
Reset\  
CS2\  
DQ24  
I
D
/O  
Q
1
15  
5
VCC  
CS4\  
ID/Q31  
Any combination of sectors can be concurrently erased  
MCM supports full array (multi-chip) Erase  
Embedded Erase and Program Algorithms  
Erase Suspend/Resume; Supports reading data from or  
programming data to a sector not being Erased  
TTL Compatible Inputs and Outputs  
I/O25  
DQ25  
D
Q
9
DQ14  
DQ30  
I
I
DQ10  
I
GND  
D
I/  
Q
O
1
1
3
3
I/O26  
DQ26  
NC  
I
DQ29  
DQ11  
I/O11  
DQ12  
I
A14  
A16  
A11  
A0  
DQ27  
I
DQ28  
I
A7  
A10  
A9  
OE\  
A17  
WE\  
A4  
A5  
A6  
A1  
A2  
A3  
A12  
A20  
66 HIP  
Military and Industrial operating temperature ranges  
A15  
VCC  
CS1\  
A19  
A13  
A8  
A18  
I/O7  
DQ7  
DQ23  
NC I/O23  
OPTION  
Access Speed  
70ns*  
MARKING  
I
D
Q0  
I/  
DI
Q
6
DQ22  
I
I/O16  
DQ16  
CS3\  
GND  
D
Q
O
1
1
I/O5  
DQ5  
I/O21  
DQ21  
D 7  
I/OQ117  
-70  
I/O3  
DQ3  
I/O4  
DQ4  
I
D
Q
2
I
DQ18  
DIQ9
I
DQ20  
90ns  
-90  
100ns  
120ns  
-100  
-120  
[Package Designator PH]  
*Contact Factory  
GENERAL DESCRIPTION  
Package  
The AS8FLC2M32B is a 64Mb FLASH Multi-Chip Module  
organized as 2M x 32 bits. The module achieves high speed  
access, low power consumption and high reliability by employ-  
ing advanced CMOS memory technology. The military grade  
product is manufactured in compliance to the MIL-PRF-38534  
specications, making the AS8FLC2M32B ideally suited for  
military or space applications. The module is offered in a  
68-lead 0.990 inch square ceramic quad at pack or 66-lead  
1.185inch square ceramic Hex In-line Package (HIP). The  
CQFP package design is targeted for those applications, which  
require low prole SMT Packaging.  
Ceramic Quad Flat Pack  
Ceramic Hex Inline Pack  
Q
P
Temperature Range  
Full Mil (MIL-PRF-38534, Class H /Q  
Military Temp (-55oC to +125oC) /XT  
Industrial (-40oC to +85oC)  
/IT  
For more products and information  
please visit our web site at  
www.micross.com  
Micross Components reserves the right to change products or specications without notice.  
AS8FLC2M32B  
Rev. 1.6 05/11  
1

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