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5962-0920501HYA PDF预览

5962-0920501HYA

更新时间: 2024-01-08 16:13:55
品牌 Logo 应用领域
MICROSS 内存集成电路
页数 文件大小 规格书
27页 372K
描述
Flash, 1MX32, 120ns, CPGA66, HERMETIC SEALED, CERAMIC, HIP-66

5962-0920501HYA 技术参数

生命周期:Obsolete零件包装代码:PGA
包装说明:PGA, PGA66,11X11针数:66
Reach Compliance Code:compliantECCN代码:3A001.A.2.C
HTS代码:8542.32.00.51风险等级:5.78
Is Samacsys:N最长访问时间:120 ns
其他特性:BOTTOM BOOT BLOCK启动块:BOTTOM
数据轮询:YESJESD-30 代码:S-CPGA-P66
长度:30.099 mm内存密度:33554432 bit
内存集成电路类型:FLASH内存宽度:32
功能数量:1部门数/规模:1,2,1,15
端子数量:66字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:1MX32封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:PGA封装等效代码:PGA66,11X11
封装形状:SQUARE封装形式:GRID ARRAY
并行/串行:PARALLEL电源:3.3 V
编程电压:3 V认证状态:Qualified
筛选级别:MIL-STD-883座面最大高度:6.223 mm
部门规模:4K,2K,8K,16K最大待机电流:0.00025 A
子类别:Flash Memories最大压摆率:0.14 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子形式:PIN/PEG端子节距:2.54 mm
端子位置:PERPENDICULAR切换位:NO
类型:NOR TYPE宽度:30.099 mm
Base Number Matches:1

5962-0920501HYA 数据手册

 浏览型号5962-0920501HYA的Datasheet PDF文件第2页浏览型号5962-0920501HYA的Datasheet PDF文件第3页浏览型号5962-0920501HYA的Datasheet PDF文件第4页浏览型号5962-0920501HYA的Datasheet PDF文件第5页浏览型号5962-0920501HYA的Datasheet PDF文件第6页浏览型号5962-0920501HYA的Datasheet PDF文件第7页 
FLASH  
AS8FLC1M32  
FIGURE 1: PIN ASSIGNMENT  
Hermetic, Multi-Chip Module  
(Top View)  
(MCM)  
32Mb, 1M x 32, 3.3Volt Boot Block FLASH Array  
Available via Applicable Specications:  
I/O0  
10  
11  
12  
60  
59  
78  
57  
76  
I/O16  
I/O17  
I/O18  
MIL-PRF-38534, Class H  
DSCC SMD 5962-09205  
I/O1  
I/02  
I/O3  
I/O4  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
I/O19  
I/O20  
I/O21  
I/O22  
I/O23  
GND  
I/O24  
I/O25  
I/O26  
I/O27  
I/O28  
I/O29  
I/O30  
I/O31  
I/O5  
I/O6  
I/O7  
GND  
I/O8  
I/O9  
55  
54  
53  
FEATURES  
52  
51  
50  
49  
48  
47  
46  
45  
44  
32Mb device, total density, organized as 1M x 32  
Bottom Boot Block (Sector) Architecture  
Operation with single 3.3V Supply  
Available in multiple Access time variations  
Individual byte control via individual byte selects (CSx\)  
Low Power CMOS  
20 years data retention  
1,000,000 Program/Erase Cycles per sector minimum  
Sector Architecture:  
I/O10  
I/O11  
I/012  
Package Designator Q
I/O13  
I/O14  
I/O15  
One 16K byte, two 8K byte, one 32K byte and  
fteen 64Kbyte sectors  
Pin Assignment  
(Top View)  
Any combination of sectors can be concurrently erased  
MCM supports full array (multi-chip) Erase  
Embedded Erase and Program Algorithms  
Erase Suspend/Resume; Supports reading data from or  
programming data to a sector not being Erased  
TTL Compatible Inputs and Outputs  
I/O8  
I/O9  
I/O10  
A14  
A16  
A11  
A0  
Reset\  
CS2\  
GND  
I/O11  
A10  
I/O24  
I/O25  
I/O26  
A7  
I/O15  
I/O14  
I/O13  
I/O12  
OE\  
VCC I/O31  
CS4\  
NC  
I/O30  
I/O29  
I/O28  
A1  
I/O27  
A4  
A12  
Military and Industrial operating temperature ranges  
A9  
A2  
A17  
WE\  
I/O7  
I/O6  
I/O5  
I/O4  
NC  
A5  
66 HIP  
A15  
A13  
A6  
A3  
A18  
I/O0  
I/O1  
I/O2  
VCC  
CS1\  
A19  
A8  
NC I/O23  
OPTION  
Access Speed  
70ns*  
MARKING  
I/O16  
I/O17  
I/O18  
CS3\  
I/O22  
I/O21  
I/O20  
GND  
-70  
90ns  
-90  
I/O3  
I/O19  
100ns  
120ns  
-100  
-120  
[Package Designator PH]  
*Contact factory  
GENERAL DESCRIPTION  
The AS8FLC1M32B is a 32Mb FLASH Multi  
Chip Module organized as 1M x 32 bits. The  
module achieves high speed access, low power consumption  
and high reliability by employing advanced CMOS memory  
technology. The military grade product is manufactured in  
compliance to the MIL-PRF-38534 specications, making the  
AS8FLC1M32B ideally suited for military or space applica-  
tions. The module is offered in a 68-lead 0.990 inch square  
ceramic quad at pack or 66-lead 1.185inch square ceramic  
Hex In-line Package (HIP). The CQFP package design is tar-  
geted for those applications, which require low prole SMT  
Packaging.  
Package  
Ceramic Quad Flat Pack  
Ceramic Hex Inline Pack  
Q
P
Temperature Range  
Full Mil (MIL-PRF-38534, Class H) /Q  
Military Temp (-55oC to +125oC) /XT  
Industrial (-40oC to +85oC)  
/IT  
For more products and information  
please visit our web site at  
www.micross.com  
Micross Components reserves the right to change products or specications without notice.  
AS8FLC1M32B  
Rev. 4.1 10/10  
1

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