Datasheet > 5962-00540

5962-00540

更新时间： 2022-01-18 20:28:00

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页数	文件大小	规格书
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5962-00540 (for TSC695F) Standard Microcircuit Drawing [Updated 4/03. 53 Pages]

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5962-00540 数据手册

TABLE IA. Electrical performance characteristics - Continued.

Test

Symbol

Conditions 1/

-55°C ≤ T_C≤ +125°C

+4.5 V ≤ V_DD≤ +5.5 V

unless otherwise specified

Group A

subgroups

Device

type

Limits

Min Max

Unit

t₅₆

_DD= 4.5 V

9, 10, 11

All

8.5

OE (LH) output delay (no

DMA mode) 11/ 12/

SYSCLK frequency = 25 MHz

See figure 5

t₅₇

BUFFEN (LH) output delay

11/ 12/

INST output delay 11/ 12/

t₆₀

t₆₁

9, 10, 11

All

Data output delay to low-Z

11/

12/

RHA devices supplied to this drawing are characterized at all levels M, D, P, L, and R of irradiation. However, this device

is only tested at the “R” level. Pre and Post irradiation values are identical unless otherwise specified in table IA. When

performing post irradiation electrical measurements for any RHA level, T_A= +25°C.

Not recorded – Tested go/no-go during functional test.

Applies to RA[31:0], RAPAR, RASI[3:0], RSIZE[1:0], RASPAR, CPAR, D[31:0], CB[6:0], DPAR, RLDSTO, DXFER, LOCK,

RD, WE , WRT, PROM8 , ROMWRT , BUSRDY , BUSERR , DMAREQ , DMAAS, SYSHALT , NOPAR , IWDE,

WDCLK, CLK2, TMODE[1:0], DEBUG, TCK, TRST , TMS, TDI.

Applies to RxA, RxB, GPI[7:0], EXTINT[4:0], EWDINT, SYSRESET .

Applies to RAPAR, RASI[3:0], RSIZE[1:0], RASPAR, CPAR, D[31:0], CB[6:0], DPAR, RLDSTO, ALE , DXFER, LOCK,

RD, WE , WRT, MHOLD , MDS , MEXC , BA[1:0], ROMCS , MEMCS[9 : 0] , BUFFEN , DDIR, DDIR , IOSEL[3 : 0] ,

IOWR , EXMCS , DMAGNT , DRDY , IUERR , CPUHALT , SYSERR , SYSAV, INULL, INST, FLUSH, DIA, RTC, TxA,

TxB, GPIINT, EXTINTACK, SYSCLK, RESET , TDO.

Applies to RA[31:0], MEMWR , OE .

Applies to PROM8 , ROMWRT , BUSRDY , BUSERR , DMAREQ , DMAAS, SYSHALT , NOPAR , RxA, RxB,

EXTINT[4:0], IWDE, EWDINT, WDCLK, CLK2, SYSRESET , TMODE[1:0], DEBUG, TCK, TRST , TMS, TDI.

Applies to PROM8 , ROMWRT , BUSRDY , BUSERR , DMAREQ , DMAAS, SYSHALT , NOPAR , RxA, RxB,

EXTINT[4:0], IWDE, EWDINT, WDCLK, CLK2, SYSRESET , TMODE[1:0], DEBUG TCK, TRST .

Applies to TMS, TDI.

10/ Applies to RA[31:0], RAPAR, RASI[3:0], RSIZE[1:0], RASPAR, CPAR, D[31:0], CB[6:0], DPAR, RLDSTO, DXFER, LOCK,

RD, WE , WRT, GPI[7:0].

11/ Tested during AC tests but not recorded.

12/ With reference edge of SYSCLK+.

13/ With reference edge of SYSCLK-.

14/ With reference edge of TCK+.

15/ With reference edge of TCK-.

SIZE

STANDARD

5962-00540

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

1...6 7 8910 11 12...53

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