Datasheet > 59362-G38-07A037LF

59362-G38-07A037LF

更新时间： 2023-08-15 00:00:00

品牌	Logo	应用领域
安费诺 - AMPHENOL		/
页数	文件大小	规格书
6页	214K
描述
Board Connector, 14 Contact(s), 2 Row(s), Male, Straight, Solder Terminal, ROHS COMPLIANT

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MINITEK™ HEADERS FOR

PIN-IN-PASTE PROCESSES

PIN-IN-PASTE

Pin-in-Paste (PiP) technology allows the use of TMT products in SMT manufacturing processes. The connectors are

automatically or manually placed on the board, then soldered in the same operationas the SMT components. Despite this,

the mechanical strenght of the TMT soldering is maintained – still an important requirement for connectors nowadays in

many industrial or automotive applications.

CONNECTOR DESIGN

In order to achieve optimum soldering results, FCI launches dedicated Pin-in-Paste connectors in the basics+

product range. These connectors are fully adapted to Pin-in-Paste processing in all aspects, including plastic material,

housing design, pin length, and packaging.

PLASTIC MATERIAL

HOUSING DESIGN

Minitek PIP headers are moulded in high temperature

thermoplastic and are able to withstand exposure to 260°C

peak temperature for 30 seconds maximum in a convection,

infra-red or vapour phase reflow oven.

Standoffs raise the housing body slightly above the PCB

surface and thus allow the molten solder paste to flow freely

from its printed position into the board hole and around the

pin. The standoffs are correctly positioned for a good

solder paste deposit around the pin. Please respect the

stencil design guidelines below in order to avoid paste

deposit around the standoffs.

PIN LENGTH

The connector lead length beyond the bottom of the PCB is

shorter than for traditional TMT products. Thus, the risk of

pushing out the solder paste when inserting the pin into the

PCB hole is very much limited. The solder paste will not stick

on the pin tip or even fall off completely, but stays

around the pin for free flow during soldering. FCI uses a

solder tail length of 2 0.2mm for Minitek Headers for a

standard PCB of 1.6mm thickness.

PACKAGING

For combining SMT and TMT components not only in the

soldering process, but also in the assembly process, FCI

proposes a choice of pick-and-place packaging for PIP

connectors. The most common part numbers are available

in tape-on-reel packaging, all others in tube.

Disclaimer

Please note that the above information is subject to change without notice.

For more information,

please contact: Communications@fci.com

or visit us at www.fci.com

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