Advanced CMOS TTL Input – 54ACT14
Rev 1.0
Hex Schmitt-Trigger Inverter with LSTTL compatible inputs in bare die form
11/03/19
Description
Features:
The 54ACT14 Hex Schmitt-Trigger Inverter is fabricated
using an advanced CMOS process combining LSTTL
speed with CMOS low power consumption while
delivering high output drive. The device performs the
Boolean function Y = Ᾱ in positive logic. Device inputs
directly accept LSTTL or CMOS. Schmitt-Trigger inputs
transform slow input rise and fall times into sharply
defined jitter-free output signals. Due to the hysteresis
voltage of the Schmitt trigger, the 54ACT14 is useful in
noisy environments. All inputs are protected against
ESD and excess voltage transients.
Schmitt Trigger Inputs
Inputs directly accept TTL
Outputs directly interface CMOS, NMOS and TTL
Outputs Sink/Source 24mA
Low power dissipation: ICC 2µA max at 25°C
High noise immunity
Functionally compatible with bipolar 54F14.
Full Military Temperature Range
Ordering Information
Die Dimensions in µm (mils)
The following part suffixes apply:
1270 (50)
No suffix - MIL-STD-883 /2010B Visual Inspection
“H” - MIL-STD-883 /2010B Visual Inspection
+ MIL-PRF-38534 Class H LAT
“K” - MIL-STD-883 /2010A Visual Inspection (Space)
+ MIL-PRF-38534 Class K LAT
LAT = Lot Acceptance Test.
For further information on LAT process flows see below.
www.siliconsupplies.com\quality\bare-die-lot-qualification
Supply Formats:
Mechanical Specification
Default – Die in Waffle Pack (400 per tray capacity)
1270 x 1100
Die Size (Unsawn)
µm
mils
50 x 43
Sawn Wafer on Tape – On request
70 x 70
Minimum Bond Pad Size
2.76 x 2.76
µm
mils
Unsawn Wafer – On request
280 (±20)
Die Thickness
µm
mils
Die Thickness <> 280µm(11 Mils) – On request
Assembled into Ceramic Package – On request
11.02 (±0.79)
Top Metal Composition
Back Metal Composition
Al-Si-Cu
N/A – Bare Si
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