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520

更新时间: 2024-02-23 02:04:33
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
96页 1585K
描述
Pentium 4 Processors Supporting Hyper-Threading Technology

520 技术参数

生命周期:Contact Manufacturer包装说明:,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8532.24.0040风险等级:5.71
电容器类型:FILM CAPACITOR介电材料:MIXED (PAPER+PLASTIC)
安装特点:THROUGH HOLE MOUNT端子数量:2
最高工作温度:85 °C最低工作温度:-55 °C
封装形状:TUBULAR PACKAGE表面贴装:NO
端子形状:WIREBase Number Matches:1

520 数据手册

 浏览型号520的Datasheet PDF文件第3页浏览型号520的Datasheet PDF文件第4页浏览型号520的Datasheet PDF文件第5页浏览型号520的Datasheet PDF文件第7页浏览型号520的Datasheet PDF文件第8页浏览型号520的Datasheet PDF文件第9页 
Contents  
Tables  
1-1 References .................................................................................................................................13  
2-1 Core Frequency to FSB Multiplier Configuration........................................................................16  
2-2 Voltage Identification Definition ..................................................................................................18  
2-3 FSB Signal Groups.....................................................................................................................21  
2-4 Signal Characteristics.................................................................................................................22  
2-5 Signal Reference Voltages.........................................................................................................22  
2-6 BSEL[2:0] Frequency Table for BCLK[1:0].................................................................................23  
2-7 Processor DC Absolute Maximum Ratings ................................................................................24  
2-8 Voltage and Current Specifications ............................................................................................25  
2-9 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Processors ...........................27  
2-10VCC Static and Transient Tolerance for 775_VR_CONFIG_04B Processors ...........................29  
2-11 GTL+ Asynchronous Signal Group DC Specifications ..............................................................31  
2-12GTL+ Signal Group DC Specifications .......................................................................................31  
2-13PWRGOOD and TAP Signal Group DC Specifications..............................................................32  
2-14VTTPWRGD DC Specifications..................................................................................................32  
2-15BSEL [2:0] and VID[5:0] DC Specifications................................................................................32  
2-16BOOTSELECT DC Specifications..............................................................................................32  
2-17VCC Overshoot Specifications ...................................................................................................33  
2-18GTL+ Bus Voltage Definitions ....................................................................................................34  
3-1 Processor Loading Specifications ..............................................................................................39  
3-2 Package Handling Guidelines ....................................................................................................39  
3-3 Processor Materials....................................................................................................................40  
4-1 Alphabetical Land Assignments .................................................................................................46  
4-2 Numerical Land Assignment.......................................................................................................56  
4-3 Signal Description.......................................................................................................................66  
5-1 Processor Thermal Specifications..............................................................................................76  
5-2 Thermal Profile for Processors with PRB = 1 .............................................................................77  
5-3 Thermal Profile for Processors with PRB = 0 .............................................................................78  
5-4 Thermal Diode Parameters ........................................................................................................83  
5-5 Thermal Diode Interface.............................................................................................................83  
6-1 Power-On Configuration Option Signals.....................................................................................85  
7-1 Fan Heatsink Power and Signal Specifications..........................................................................92  
7-2 Fan Heatsink Power and Signal Specifications..........................................................................96  
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Datasheet  

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