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501S42E0R8C23Z

更新时间： 2024-02-10 09:34:45
品牌 Logo 应用领域
约翰逊 - JOHANSON 电容器
页数 文件大小 规格书
11页 522K
描述
CAP,CERAMIC,800FF,500VDC,.25PF -TOL,.25PF +TOL,NP0 TC CODE,-30,30PPM TC

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501S42E0R8C23Z 技术参数

是否Rohs认证： 符合生命周期：Contact Manufacturer
包装说明：, 1411Reach Compliance Code：compliant
ECCN代码：EAR99风险等级：5.65
电容：8e-7 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMIC高度：2.59 mm
长度：3.43 mm多层：Yes
负容差：31.25%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形式：Axial包装方法：TR, Embossed
正容差：31.25%额定（直流）电压（URdc）：500 V
系列：E(LEADED)尺寸代码：1411
温度特性代码：NP0温度系数：-/+30ppm/Cel ppm/ °C
宽度：2.79 mmBase Number Matches：1

501S42E0R8C23Z 数据手册

 浏览型号501S42E0R8C23Z的Datasheet PDF文件第1页浏览型号501S42E0R8C23Z的Datasheet PDF文件第2页浏览型号501S42E0R8C23Z的Datasheet PDF文件第3页浏览型号501S42E0R8C23Z的Datasheet PDF文件第5页浏览型号501S42E0R8C23Z的Datasheet PDF文件第6页浏览型号501S42E0R8C23Z的Datasheet PDF文件第7页 
DIELECTRIC  
CHARACTERISTICS  
NPO  
X7R  
TEMPERATURE COEFFICIENT:  
QUALITY FACTOR / DF:  
0
30ppm /°C, -55 to 125°C  
15%, -55 to 125°C  
Q
>1,000 @ 1 MHz, Typical 10,000  
16VDC Dp≤ 3.5% @ 1 KHz, 25°C  
10VDC Dp≤ 5.0% @ 1 KHz, 25°C  
INSULATION RESISTANCE:  
>10 GΩ @ 25°C,WVDC;  
125°C IR is 10% of 25°C rating  
>500 ΩF* or 10 GΩ* @ 25°C,WVDC;  
125°C IR is 10% of 25°C rating  
* whichever is less  
DIELECTRIC STRENGTH:  
TEST PARAMETERS:  
2.5 X WVDC Min., 25°C, 50 mA max  
1MHz 50kHz, 1.0 0.2 VRMS, 25°C  
2.5 X WVDC Min., 25°C, 50 mA max  
1KHz 50Hz, 1.0 0.2 VRMS, 25°C  
100 - 10,000 pF  
AVAILABLE CAPACITANCE:  
Size 01005: 0.2 - 10 pF  
Size 0201: 0.2 - 100 pF  
Size 0402: 0.2 - 33 pF  
Size 0603: 0.2 - 100 pF  
Size 0805: 0.3 - 220 pF  
Size 1111: 0.2 - 1000 pF  
Size 2525: 1.0 - 2700 pF  
Size 3838: 1.0 - 5100 pF  
MECHANICAL & ENVIRONMENTAL  
CHARACTERISTICS  
SPECIFICATION  
TEST PARAMETERS  
SOLDERABILITY:  
Solder coverage ≥ 90% of metalized areas  
No termination degradation  
Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux  
then dip in Sn62 solder @ 240° 5°C for 5 1 sec  
RESISTANCE TO  
SOLDERING HEAT:  
No mechanical damage  
Capacitance change: 2.5% or 0.25pF  
Q>500 I.R. >10 G Ohms  
Preheat device to 80°-100°C for 60 sec.  
followed by 150°-180°C for 60 sec.  
Dip in 260° 5°C solder for 10 1 sec.  
Measure after 24 2 hour cooling period  
Breakdown voltage: 2.5 x WVDC  
TERMINAL  
ADHESION:  
Termination should not pull off.  
Ceramic should remain undamaged.  
Linear pull force* exerted on axial leads soldered to each terminal.  
*0402 ≥ 2.0lbs, 0603 ≥ 2.0lbs (min.)  
PCB DEFLECTION:  
No mechanical damage.  
Capacitance change: 2% or 0.5pF Max  
Glass epoxy PCB: 0.5 mm deflection  
LIFE TEST:  
No mechanical damage  
Capacitance change: 3.0% or 0.3 pF  
Q>500 I.R. >1 G Ohms  
Applied voltage: 200% rated voltage, 50 mA max.  
Temperature: 125° 3°C  
Test time: 1000+48-0 hours  
Breakdown voltage: 2.5 x WVDC  
THERMAL CYCLE:  
No mechanical damage.  
Capacitance change: 2.5% or 0.25pF  
Q>2000 I.R. >10 G Ohms  
5 cycles of: 30 3 minutes @ -55°+0/-3°C,  
2-3 min. @ 25°C, 30 3 min. @ +125°+3/-0°C,  
2-3 min. @ 25°C  
Breakdown voltage: 2.5 x WVDC  
Measure after 24 2 hour cooling period  
HUMIDITY,  
STEADY STATE:  
No mechanical damage.  
Relative humidity: 90-95%  
Temperature: 40° 2°C  
Test time: 500 +12/-0 Hours  
Measure after 24 2 hour cooling period  
Capacitance change: 5.0% or 0.50pF max.  
Q>300 I.R. ≥ 1 G-Ohm  
Breakdown voltage: 2.5 x WVDC  
HUMIDITY,  
LOW VOLTAGE:  
No mechanical damage.  
Capacitance change: 5.0% or 0.50pF max.  
Q>300 I.R. = 1 G-Ohm min.  
Applied voltage: 1.5 VDC, 50 mA max.  
Relative humidity: 85 2% Temperature: 40° 2°C  
Test time: 240 +12/-0 Hours  
Breakdown voltage: 2.5 x WVDC  
Measure after 24 2 hour cooling period  
VIBRATION:  
No mechanical damage.  
Capacitance change: 2.5% or 0.25pF  
Q>1000 I.R. ≥ 10 G-Ohm  
Breakdown voltage: 2.5 x WVDC  
Cycle performed for 2 hours in each of three perpendicular directions  
Frequency range 10Hz to 55 Hz to 10 Hz traversed  
in 1 minute. Harmonic motion amplitude: 1.5mm  
10  
www.johansontechnology.com  
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