Datasheet > 4606X-AP1-332

4606X-AP1-332

更新时间： 2024-02-03 17:50:09

品牌	Logo	应用领域
伯恩斯 - BOURNS		电阻器网络
页数	文件大小	规格书
62页	1878K
描述
Resistor Networks Product Selection Guide

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技术参数
数据手册

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4606X-AP1-332 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	SIP, 6010
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8533.21.00.50	Factory Lead Time：	14 weeks
风险等级：	5.18	构造：	Epoxy Resin
元件功耗：	0.2 W	第一元件电阻：	3300 Ω
JESD-609代码：	e1	引线长度：	3.3 mm
引线间距：	2.54 mm	安装特点：	THROUGH HOLE MOUNT
网络类型：	BUSSED	元件数量：	5
功能数量：	1	端子数量：	6
最高工作温度：	125 °C	最低工作温度：	-55 °C
封装高度：	8.89 mm	封装长度：	15.19 mm
封装形状：	RECTANGULAR PACKAGE	封装形式：	SIP
封装宽度：	2.49 mm	包装方法：	AMMO PACK
额定功率耗散 (P)：	0.75 W	额定温度：	70 °C
电阻：	3300 Ω	电阻器类型：	ARRAY/NETWORK RESISTOR
尺寸代码：	6010	子类别：	Array/Network Resistors
表面贴装：	NO	技术：	METAL GLAZE/THICK FILM
温度系数：	100 ppm/ °C	温度系数跟踪：	50 ppm/ °C
端子面层：	Tin/Silver/Copper (Sn/Ag/Cu)	端子形状：	FLAT
容差：	2%	工作电压：	100 V
Base Number Matches：	1

4606X-AP1-332 数据手册

Soldering/Cleaning Methods

FLOW

REFLOW

Hot Air,

Infrared

(Solvent)

Vapor Phase

Wave

Process Step

(Solvent)

(Aqueous)

Material

RMA

1. Solder Paste Printing

2. Adhesive Application

3. Switch Placement

4. Adhesive Cure

Epoxy

These are the common

methods, materials and

maximum temperature/

time parameters for

soldering and cleaning

processes:

5. Flux Application

6. Solder (Reflow)

7. Solder (Flow)

Rosin

Organic Acid

63/37 Sn/Pb

ODS Free

8. Wash (Solvent)

9. Wash (Aqueous)

High Pressure Fluids

Ultrasonics

DI H₂O; Detergent

Max. Temp.(°C)/Time (Seconds)

240/30

215/180

260/5

6 7 8 9

Solder

Wash

Reflow; Convection,

IR and Vapor Phase

Flow (Wave)

Solvent

Aqueous

GENERAL

Preheat sufficiently using both time

and temp. to bring the flux to activa-

tion and minimize thermal shock.

Consult your solder paste supplier for

the recommended profile.

For maximum component reliability

and performance, minimize the time

of temp. exposure above 200°C.

Use solvent cleaning primarily

for nonpolar contaminants

such as rosin based flux

residues.

Use aqueous cleaning primarily

for polar contaminants such as

organic flux residues.

RECOMMENDED

Typical alloy is Sn63/Pb37. A typical

wave solder zone profile is 245˚C for

5 sec.

RECOMMENDED

Use any suitable washing sol-

vents that meet ODS require-

ments.

Use De-ionized or Reverse

Osmosis water with multistage

rinsing. Post bake at 100˚C for

30 minutes to remove any resid-

ual moisture.

RECOMMENDED

Typical IR/Convection profile.

PRE-HEATING SOLDERING GRADUAL COOLING

CAUTION

Limit excessive direct spray

pressure to 60 psi.

(in air)

CAUTION

Limit excessive direct spray

245°C

200°C

230°C

pressure to 60 psi.

100°C

0°C

100°C

0°C

Allow the assembly to suffi-

ciently cool prior to the wash-

ing operation for minimized

thermal stress.

ONE MINUTE

MIN.

Allow the assembly to sufficient-

ly cool prior to the washing oper-

ation for minimized thermal

stress.

5 SECOND

MAX.

ONE MINUTE

MIN.

20 SECOND

MAX.

Use convection or Vapor Phase when

possible and minimize the time above

reflow temperature.

CAUTION

Always preheat before the soldier

wave using the temperature for flux

activation recommended by the man-

ufacturer.

CAUTION

Do not exceed time and temperature

reflow profile of 240°C for 30 sec. for

Hot Air/IR reflow and 215°C for 3

minutes for vapor phase reflow.

Board Rework Technique

Do not exceed 240˚C peak tempera-

ture for dual wave solder process

with a flow zone totaling 5 seconds.

RECOMMENDED

Hot air reflow technique is pre-

ferred. Use No Clean or Rosin

based fluxes only, OA fluxes are

recommended.

Minimize thermal shock by limiting

temperature ramps to 3°C/sec. and by

stabilizing board and component tem-

perature during preheating.

Minimize thermal shock by limiting

temperature ramps to 3˚C/sec. and by

stabilizing board and component

temperature during preheating.

GENERAL

CAUTION

Excessive and/or repeated high

temperature exposure may

affect the component perfor-

mance and reliability.

Avoid the use of wave soldering

or soldering irons as a rework

technique. Avoid repeated and

excessive temperature exposure.

Specifications are subject to change without notice.

337

1...58 59 606162

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与4606X-AP1-332相关器件

型号	品牌	描述	获取价格	数据表
4606X-AP1-332LF	BOURNS	Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.75W, 3300ohm, 100V, 2% +/-Tol, 1	获取价格
4606X-AP1-334	BOURNS	RESISTOR, NETWORK, FILM, BUSSED, 0.75W, THROUGH HOLE MOUNT, SIP	获取价格
4606X-AP1-334LF	BOURNS	Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.75W, 330000ohm, 100V, 2% +/-Tol,	获取价格
4606X-AP1-393LF	BOURNS	Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.75W, 39000ohm, 100V, 2% +/-Tol,	获取价格
4606X-AP1-394FLF	BOURNS	Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.2W, 390000ohm, 100V, 1% +/-Tol,	获取价格
4606X-AP1-821LF	BOURNS	Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.75W, 820ohm, 100V, 2% +/-Tol, 10	获取价格

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