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3SMBJ5953B-TP PDF预览

3SMBJ5953B-TP

更新时间: 2024-02-04 18:26:29
品牌 Logo 应用领域
美微科 - MCC 测试二极管
页数 文件大小 规格书
4页 279K
描述
Zener Diode, 150V V(Z), 5%, 3W,

3SMBJ5953B-TP 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.77
配置:SINGLE二极管类型:ZENER DIODE
最大动态阻抗:600 ΩJESD-609代码:e3
湿度敏感等级:1元件数量:1
最高工作温度:150 °C峰值回流温度(摄氏度):260
最大功率耗散:3 W标称参考电压:150 V
子类别:Voltage Reference Diodes表面贴装:YES
端子面层:Tin (Sn)处于峰值回流温度下的最长时间:10
最大电压容差:5%工作测试电流:2.5 mA
Base Number Matches:1

3SMBJ5953B-TP 数据手册

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3SMBJ5913B  
THRU  
3SMBJ5956B  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
3.0 Watt  
Surface Mount  
Silicon  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
3.3thru 200 Volt Voltage Range  
·
Low Inductance, Low Profile Mounting  
Glasss Passivated Junction  
Available On Tape and Reel  
Zener Diodes  
Halogen free available upon request by adding suffix "-HF"  
Epoxy meets UL 94 V-0 flammability rating  
·
Moisture Sensitivity Level 1  
DO-214AA  
(SMB) (LEAD FRAME)  
Mechanical Data  
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band.  
Packaging: Standard 12mm Tape (see EIA 481)  
Maximum temperature for soldering: 2600C for 10 seconds.  
A
B
Maximum Ratings @ 25oC Unless Otherwise Specified  
C
Maximum  
F
H
VF  
Pd  
1.5V  
(Note: 2)  
(Note: 3)  
Forward  
Voltage  
D
G
Steady State  
3.0W  
Power  
E
Dissipation  
Operation and  
Storage  
Temperature  
TJ, TSTG -55oC to  
+150 oC  
DIMENSIONS  
INCHES  
MIN  
MM  
MIN  
DIM  
A
MAX  
.185  
.155  
.012  
.060  
.220  
.096  
.087  
.008  
MAX  
4.70  
3.94  
0.31  
1..52  
5.59  
2.44  
2.21  
0.203  
NOTE  
.160  
.130  
.006  
.030  
.200  
.079  
.075  
.002  
4.06  
3.30  
0.15  
0.76  
5.08  
2.00  
1.91  
0.05  
B
C
D
E
F
G
H
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
SUGGESTED SOLDER  
PAD LAYOUT  
2.  
3.  
Forward Current @ 200mA.  
0.106"  
Mounted on 5.0mm2 (1oz thick) Iand areas.  
Lead temperature at TL=75oC  
0.083”  
0.050”  
www.mccsemi.com  
Revision: B  
2013/01/01  
1 of 4  

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