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3SMAJ5930B-TP PDF预览

3SMAJ5930B-TP

更新时间: 2024-09-21 12:53:51
品牌 Logo 应用领域
美微科 - MCC 稳压二极管齐纳二极管测试光电二极管PC
页数 文件大小 规格书
4页 266K
描述
3.0 Watt Surface Mount Silicon Zener Diodes

3SMAJ5930B-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DO-214AC
包装说明:R-PDSO-C2针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:1.26
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:1786810Samacsys Pin Count:2
Samacsys Part Category:Zener DiodeSamacsys Package Category:Diodes Moulded
Samacsys Footprint Name:SMA (DO-214AC)Samacsys Released Date:2020-03-24 14:15:44
Is Samacsys:N配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
最大动态阻抗:10 ΩJEDEC-95代码:DO-214AC
JESD-30 代码:R-PDSO-C2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:UNIDIRECTIONAL
最大功率耗散:3 W认证状态:Not Qualified
标称参考电压:16 V子类别:Voltage Reference Diodes
表面贴装:YES技术:ZENER
端子面层:Matte Tin (Sn)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:10
最大电压容差:5%工作测试电流:23.4 mA
Base Number Matches:1

3SMAJ5930B-TP 数据手册

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3SMAJ5913B  
THRU  
3SMAJ5943B  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
3.0 Watt  
Surface Mount  
Silicon  
Surface Mount Application  
3.3V thru 56 Volt Voltage Range  
Low Inductance , Low Profile Mounting  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Glass Passivated Junction  
High specified maximum current (IZM) when adequately heat sinking  
Zener Diodes  
Mechanical Data  
DO-214AC  
Epoxy meets UL 94 V-0 flammability rating  
(SMA) (LEAD FRAME)  
Moisture Sensitivity Level 1  
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band.  
H
Packaging: Standard 12mm Tape (see EIA 481)  
Maximum temperature for soldering: 2600C for 10 seconds.  
J
Maximum Ratings @ 25oC Unless Otherwise Specified  
A
C
E
Maximum  
VF  
D
B
F
1.5V  
(Note: 2)  
(Note: 3)  
Forward  
Voltage  
G
Steady State  
Pd  
3.0W  
DIMENSIONS  
Power  
INCHES  
MIN  
.079  
.050  
.002  
---  
MM  
MIN  
2.00  
1.27  
.05  
Dissipation  
DIM  
A
MAX  
MAX  
2.44  
1.63  
.20  
NOTE  
Operation and  
Storage  
Temperature  
TJ, TSTG -55oC to  
.096  
.064  
.008  
.02  
B
+150oC  
C
D
E
---  
.51  
.030  
.065  
.189  
.157  
.090  
.060  
.091  
.220  
.181  
.115  
.76  
1.52  
2.32  
5.59  
4.60  
2.92  
F
1.65  
4.80  
4.00  
2.25  
G
H
J
Thermal  
25R/W  
Resistance  
Junction to Lead  
RthJL  
SUGGESTED SOLDER  
PAD LAYOUT  
0.090"  
Note: 1.  
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
2.  
Forward Current @ 200mA.  
3.  
Mounted on 5.0mm2 (1oz thick) Iand areas.  
0.085"  
o
Lead temperature at T  
L=75  
C
0.070"  
www.mccsemi.com  
Revision: A  
2011/01/01  
1 of 4  

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