Mechanical Package Dimensions
Mechanical Package Dimensions
0.20 T L-M N
0.20 T L-M N
4X
4X 36 TIPS
PIN 1
144
109
IDENT
1
108
4X
P
J1
J1
L
M
C
L
V
B
X
140X
G
B1
V1
VIEW Y
VIEW Y
36
73
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
37
72
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M, N TO BE DETERMINED AT
THE SEATING PLANE, DATUM T.
N
A1
S1
4. DIMENSIONS S ANDVTOBE DETERMINED
AT SEATING PLANE, DATUM T.
5. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE.
A
S
DIMENSIONS A AND B DO INCLUDEMOLD
MISMATCH AND ARE DETERMINED AT
DATUM PLANE H.
6. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
VIEW AB
C
144X
MILLIMETERS
0.1 T
θ
2
DIM MIN MAX
A
A1
B
20.00 BSC
10.00 BSC
20.00 BSC
10.00 BSC
SEATING
PLANE
θ
2
B1
C
1.40
0.05
1.35
0.17
0.45
0.17
1.60
T
C1
C2
D
0.15
1.45
0.27
0.75
0.23
E
PLATING
F
G
0.50 BSC
J
C2
AA
F
J
0.09
0.20
0.05
K
0.50 REF
P
0.25 BSC
R2
R1
R2
S
0.13
0.13
0.20
0.20
θ
R1
22.00 BSC
11.00 BSC
22.00 BSC
11.00 BSC
0.25 REF
1.00 REF
S1
V
BASE
0.25
V1
Y
METAL
D
GAGE PLANE
Z
M
0.08
T L-M N
AA
θ
0.09
0.16
0
0
°
°
°
SECTION J1-J1
(K)
E
θ
θ
1
2
7
°
°
(ROTATED 90
144 PL
)
°
11
13
C1
θ
1
(Y)
VIEW AB
(Z)
Figure 3. 144-pin LQFP Mechanical Dimensions (case no. 918-03)
16-bit Microcontroller HCS12H Family, Rev. 11.1
Freescale Semiconductor
25
PRELIMINARY