Datasheet > 357VB3I001M5000

357VB3I001M5000

更新时间： 2023-02-26 14:42:32

品牌	Logo	应用领域
西迪斯 - CTS		/
页数	文件大小	规格书
4页	136K
描述
Oscillator

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中文翻译

获取价格

数据手册

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357VB3I001M5000 数据手册

Model 357

7x5mm Low Cost

HCMOS/TTL Compatible VCXO

CMOS/TTL OUTPUT WAVEFORM

TEST CIRCUIT, CMOS LOAD

VOH

N.C. or Enable Input

90%, 80%, 2.4V

50%, 1.5V

D.U.T.

0.01uF

POWER

SUPPLY

C L

10%, 20%, 0.5V

capacitance.

VOL

UPTIME (t)

PERIOD (T)

POWER +

SUPPLY

DUTY CYCLE = t/T x 100 (%)

Enable Input or N.C.

D.U.T. PIN ASSIGNMENTS

SYMBOL

DESCRIPTION

Control Voltage

ENABLE TRUTH TABLE

V_C

EOH or N.C. Enable or No Connect

PIN 2 or PIN 5

Logic ‘1’

PIN 4

Output

GND

Output

Circuit & Package Ground

RF Output

Open

Logic ‘0’

N.C. or EOH No Connect or Enable

V_CCSupply Voltage

High Imp.

MECHANICAL SPECIFICATIONS

PACKAGE DRAWING

MARKING INFORMATION

(7.0 ±0.2)

0.276 ±0.008

(1.4)

0.055

PIN 1 IDENTIFIER

1. ** - Manufacturing Site Code.

2. YYWW – Date code, YY – year, WW – week.

3. Truncated CTS part number.

4. XXXMXXXX - Frequency marked with 4

significant digits after the ‘M’.

(1.27)

0.050

CTS ** YYWW

357LB3C

● XXXMXXXX

(5.0 ±0.2)

0.197 ±0.008

(3.73)

0.147

NOTES

1. Termination pads (e4), barrier-plating is nickel

(Ni) with gold (Au) flash plate.

2. Reflow conditions per JEDEC J-STD-020.

(2.54)

0.100

(5.08)

0.200

(2.0)

0.079

MAX

(mm)

Inch

Key:

SUGGESTED SOLDER PAD GEOMETRY

SUGGESTED REFLOW PROFILE

.071 [1.80]

300

200

100

Maximum 260°C, 10 seconds

Typical 245°C

C ^BYPASS

Temp.

(°C)

.165 [4.20]

130°C

.079 [2.00]

.100 [2.54]

120 150 180 210 240 270 300

[mm]

Key:

Time (Seconds)

.200 [5.08]

Inch

C_BYPASSshould be ≥ 0.01 uF.

Document No. 008-0244-0

Page 3 - 4

Rev. H

CTS Electronic Components, Inc.

171 Covington Drive

Bloomingdale, IL 60108

1 234

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