303134, 303135, 303136, 303137, 303138
Vishay Foil Resistors
FIGURE 4 - RECOMMENDED MOUNTING (1)(2)(3)
25 % to 85 % of T
A low profile solder fillet is
recommended to avoid unnecessary
stresses along top edge of
metallization. IR and vapor phase
reflow are best.
Notes
(1) Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction
(2) Vacuum pick up is recommended for handling
(3) Soldering iron may damage the resistor
MODEL NUMBER
303134
0805
303135
1206
303136
1506
303137
2010
303138
2512
CHIP SIZE
VALUE RANGE (SPACE APPLICATIONS)
RATED POWER AT 70 °C
10 to 5 k
100 mW
10 to 14 k
150 mW
10 to 16 k
200 mW
10 to 35 k
300 mW
10 to 75 k
400 mW
Notes
(1)
Measurement error allowed for R limits: 0.01 .
An additional 54 sample units per lot which successfully pass 100 % screening are to be used for destructive testing and are to be kept on
file at the plant of manufacture.
Lot definition (1 lot = 1 primary flowcard): Each value per chip size should be qualified individually. Contact Vishay application engineering for
alternative lot definitions.
For prototype units, append a “U” to the model number (example: 303134U). These units have all of the table 2A 100 % tests performed, with
no destructive qualification testing required.
(2)
(3)
(4)
TABLE 5 - EEE-INST-002 (TABLE 2A FILM/FOIL, LEVEL 1) 100 % TESTS/INSPECTIONS
Pre-cap Visual Inspection
Performed in production flow prior overcoating
RC Record
In tolerance
Thermal Shock
25 x (- 65 °C to + 150 °C)
Power Conditioning
RC Record
70 °C, 100 h, 1.5 rated power - not to exceed max. voltage
In tolerance R = 0.05 % for thermal shock and conditioning combined
5 % PDA on R only, 10 % PDA on “Out of Final Tolerance”
Materials, design, etc.
Final Inspection
Visual Inspection
Mechanical Inspection
Physical dimensions, sample size: 3 units, zero failure
Document Number: 63169
Revision: 29-Mar-10
For any questions, contact: foil@vishaypg.com
www.foilresistors.com
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