Datasheet > 2NBS16-RJ2-332LF

2NBS16-RJ2-332LF

更新时间： 2023-01-02 14:12:53

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
4页	342K
描述
Array/Network Resistor, Bussed, Thin Film, 1W, 3300ohm, 50V, 5% +/-Tol, 150ppm/Cel, Surface Mount, 1639, SOIC, ROHS COMPLIANT

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2NBS16-RJ2-332LF 数据手册

Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors

Mechanical Characteristics

QSOP Package Dimensions

Narrow-Body SOIC Package Dimensions

1.27

(.050)

.635

(.025)

TYP.

3.81 - 3.99

(.150 - .157)

.21 - .31

(.008 - .012)

0.36 - 0.46

(.014 - .018)

PIN 1

1.35 - 1.75

(.053 - .069)

1.35 - 1.75

(.053 - .069)

.10 - .25

(.004 - .010)

.10 - .25

(.004 - .010)

.19 - .25

(.007 - .010)

0-8 °

.19 - .25

(.007 - .010)

0-8 °

.41 - 1.27

(.016 - .050)

5.80 - 6.20

(.228 - .244)

.41 - 1.27

(.016 - .050)

5.80 - 6.20

(.228 - .244)

Model

±QSP16

±QSP±0

±QSP±4

±QSP±8

Model

±NBS08

±NBS14

±NBS16

4.80 - 4.98 (.189 - .196)

8.ꢀ6 - 8.74 (.337 - .344)

9.80 - 9.98 (.386 - .393)

4.80 - 4.98 (.189 - .196)

8.ꢀ6 - 8.74 (.337 - .344)

9.80 - 9.98 (.386 - .393)

Governing dimensions are in mm. Dimensions in

parentheses are in inches and are approximate.

Governing dimensions are in mm. Dimensions in

parentheses are in inches and are approximate.

JEDEC Reference Number MS-012.

JEDEC Reference Number MO-137.

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

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