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2N7002NXBK PDF预览

2N7002NXBK

更新时间: 2023-09-03 20:37:02
品牌 Logo 应用领域
安世 - NEXPERIA /
页数 文件大小 规格书
14页 284K
描述
60 V, N-channel Trench MOSFETProduction

2N7002NXBK 数据手册

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Nexperia  
2N7002NXBK  
60 V, N-channel Trench MOSFET  
9. Thermal characteristics  
Table 6. Thermal characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
350  
270  
65  
Max  
405  
310  
75  
Unit  
K/W  
K/W  
K/W  
Rth(j-a)  
thermal resistance from in free air  
junction to ambient  
[1]  
[2]  
-
-
-
Rth(j-sp)  
thermal resistance from  
junction to solder point  
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm2.  
aaa-014128  
3
10  
duty cycle = 1  
Z
th(j-a)  
(K/W)  
0.75  
0.50  
0.25  
0.33  
0.20  
2
10  
0.10  
0.05  
0.02  
0.01  
0
10  
-3  
10  
-2  
-1  
2
3
10  
10  
1
10  
10  
10  
t
p
(s)  
FR4 PCB, standard footprint  
Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values  
aaa-014129  
3
10  
Z
th(j-a)  
(K/W)  
duty cycle = 1  
0.75  
0.50  
2
0.33  
0.20  
10  
0.25  
0.10  
0.05  
0.02  
0.01  
0
10  
-3  
10  
-2  
-1  
2
3
10  
10  
1
10  
10  
10  
t
p
(s)  
FR4 PCB, mounting pad for drain 1 cm2  
Fig. 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values  
©
2N7002NXBK  
All information provided in this document is subject to legal disclaimers.  
Nexperia B.V. 2019. All rights reserved  
Product data sheet  
25 July 2019  
5 / 14  
 
 

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