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2N4123_08 PDF预览

2N4123_08

更新时间: 2022-09-16 12:15:47
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
6页 116K
描述
General Purpose Transistors

2N4123_08 数据手册

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2N4123, 2N4124  
General Purpose  
Transistors  
NPN Silicon  
http://onsemi.com  
Features  
PbFree Packages are Available*  
COLLECTOR  
3
MAXIMUM RATINGS  
Rating  
2
Symbol  
Value  
Unit  
BASE  
CollectorEmitter Voltage  
2N4123  
V
CEO  
Vdc  
30  
25  
2N4124  
1
EMITTER  
CollectorBase Voltage  
2N4123  
V
CBO  
Vdc  
40  
30  
2N4124  
EmitterBase Voltage  
V
EBO  
5.0  
Vdc  
Collector Current Continuous  
I
200  
mAdc  
TO92  
CASE 29  
STYLE 1  
C
Total Device Dissipation @ T = 25°C  
P
625  
5.0  
mW  
mW/°C  
A
D
Derate above 25°C  
Total Device Dissipation @ T = 25°C  
P
D
1.5  
12  
W
mW/°C  
C
1
1
2
3
2
Derate above 25°C  
3
Operating and Storage Junction  
Temperature Range  
T , T  
55 to +150  
°C  
STRAIGHT LEAD  
BULK PACK  
BENT LEAD  
TAPE & REEL  
AMMO PACK  
J
stg  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
MARKING DIAGRAM  
Thermal Resistance, JunctiontoAmbient  
R
q
JA  
200  
°C/W  
Thermal Resistance, JunctiontoCase  
R
q
JC  
83.3  
°C/W  
2N  
412x  
AYWW G  
G
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
RecommendedOperating Conditions may affect device reliability.  
x = 3 or 4  
A = Assembly Location  
Y = Year  
WW = Work Week  
G = PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
2N4123RLRM  
2N4124G  
TO92  
2000 / Tape & Ammo  
5000 Units / Bulk  
TO92  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our PbFree strategy and soldering details, please  
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference  
Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
November, 2008 Rev. 4  
2N4123/D  

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