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298D156X96R3M4T

更新时间： 2024-01-06 22:49:28
品牌 Logo 应用领域
威世 - VISHAY 电容器
页数 文件大小 规格书
12页 167K
描述
CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3 V, 15 uF, SURFACE MOUNT, 0603, CHIP, GREEN

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298D156X96R3M4T 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：, 0603
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.21.00.50风险等级：5.66
电容：15 µF电容器类型：TANTALUM CAPACITOR
介电材料：TANTALUM (DRY/SOLID)高度：0.8 mm
JESD-609代码：e4漏电流：0.001 mA
长度：1.6 mm安装特点：SURFACE MOUNT
负容差：10%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE封装形式：SMT
包装方法：TR, EMBOSSED PLASTIC, 7 INCH极性：POLARIZED
正容差：10%额定（直流）电压（URdc）：6.3 V
纹波电流：60 mA系列：298D
尺寸代码：0603表面贴装：YES
Delta切线：0.2端子面层：Gold (Au)
端子形状：WRAPAROUND宽度：0.85 mm
Base Number Matches：1

298D156X96R3M4T 数据手册

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298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS  
ITEM  
CONDITION  
POST TEST PERFORMANCE  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
1000 h application of rated voltage at 85 °C  
with a 3 series resistance,  
MIL-STD-202G method 108A  
Life Test at + 85 °C  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
At 40 °C/90 % RH 500 h, no voltage applied.  
MIL-STD-202G method 103B  
Humidity Tests  
Thermal Shock  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
At - 55 °C/+ 125 °C, 30 min each, for 5 cycles.  
MIL-STD-202G method 107G  
MECHANICAL PERFORMANCE CHARACTERISTICS  
ITEM  
CONDITION  
POST TEST PERFORMANCE  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Initial specified value or less  
Initial specified value or less  
Apply a pressure load of 5 N for 10 s 1 s  
horizontally to the center of capacitor side body.  
AEC Q-200 rev. C method 006  
Terminal Strength  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
With parts soldered onto substrate test board,  
apply force to the test board for a deflection  
of 1 mm. AEC-Q200 rev. C method 005  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Initial specified value or less  
Initial specified value or less  
Substrate Bending  
(Board flex)  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Initial specified value or less  
Initial specified value or less  
MIL-STD-202G, method 204D,  
10 Hz to 2000 Hz, 20 g peak  
Vibration  
Shock  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Initial specified value or less  
Initial specified value or less  
MIL-STD-202G, method 213B, Condition I,  
100 g peak  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
Resistance to Solder  
Heat  
At 260 °C, for 10 s, reflow  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
MIL-STD-202G, method 208H, ANSI/J-STD-002,  
Test B. Applies only to solder and tin plated  
terminations. Does not apply to gold  
terminations.  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Solderability  
Resistance to  
Solvents  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
MIL-STD-202, method 215D  
Encapsulation materials meet UL 94 V-0 with an  
oxygen index of 32 %  
Flammability  
www.vishay.com  
42  
For technical questions, contact: tantalum@vishay.com  
Document Number: 40065  
Revision: 24-May-11  
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
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