Datasheet > 27LV256-30I/VS

27LV256-30I/VS

更新时间： 2024-02-26 20:33:12

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
12页	64K
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27LV256-30I/VS 数据手册

27LV256

256K (32K x 8) Low-Voltage CMOS EPROM

FEATURES

PACKAGE TYPES

PDIP

• Wide voltage range 3.0V to 5.5V

• High speed performance

V_PP• 1

28 V_CC

27 A14

26 A13

25 A8

24 A9

23 A11

22 OE

21 A10

20 CE

19 O7

18 O6

17 O5

16 O4

15 O3

A12

- 200 ns access time available at 3.0V

• CMOS Technology for low power consumption

- 8 mA Active current at 3.0V

- 20 mA Active current at 5.5V

- 100 µA Standby current

• Factory programming available

• Auto-insertion-compatible plastic packages

• Auto ID aids automated programming

• Separate chip enable and output enable controls

• High speed “Express” programming algorithm

• Organized 32K x 8: JEDEC standard pinouts

- 28-pin Dual-in-line package

V_SS14

PLCC

A11

- 32-pin PLCC package

A10

- 28-pin SOIC package

- 28-pin VSOP package

- Tape and reel

• Data Retention > 200 years

• Available for the following temperature ranges:

- Commercial:

- Industrial:

0˚C to +70˚C

SOIC

-40˚C to +85˚C

VPP

A12

VCC

A14

A13

DESCRIPTION

The Microchip Technology Inc. 27LV256 is a low volt-

age (3.0 volt) CMOS EPROM designed for battery

powered applications. The device is organized as a

32K x 8 (32K-Byte) non-volatile memory product. The

27LV256 consumes only 8 mA maximum of active cur-

rent during a 3.0 volt read operation therefore improv-

ing battery performance. This device is designed for

very low voltage applications where conventional 5.0

volt only EPROMS can not be used. Accessing individ-

ual bytes from an address transition or from power-up

(chip enable pin going low) is accomplished in less than

200 ns at 3.0V. This device allows systems designers

the ability to use low voltage non-volatile memory with

today’s' low voltage microprocessors and peripherals

in battery powered applications.

A11

A10

V^SS

VSOP

A11

A13

A14

A10

V^SS

V^CC

V^PP

A complete family of packages is offered to provide the

most ﬂexibility in applications. For surface mount appli-

cations, PLCC, VSOP or SOIC packaging is available.

Tape and reel packaging is also available for PLCC or

SOIC packages.

A12

1996 Microchip Technology Inc.

DS11020F-page 1

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