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25ST225MB23225 PDF预览

25ST225MB23225

更新时间： 2024-02-01 12:31:59
品牌 Logo 应用领域
红宝石 - RUBYCON 电容器
页数 文件大小 规格书
3页 66K
描述
Film Capacitor, 25V, 20% +Tol, 20% -Tol, 2.2uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT

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中文翻译

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25ST225MB23225 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete包装说明：, 1210
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8532.25.00.45风险等级：8
电容：2.2 µF电容器类型：FILM CAPACITOR
JESD-609代码：e3安装特点：SURFACE MOUNT
负容差：20%端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE正容差：20%
额定（直流）电压（URdc）：25 V尺寸代码：1210
表面贴装：YES端子面层：Tin (Sn)
端子形状：WRAPAROUNDBase Number Matches：1

25ST225MB23225 数据手册

 浏览型号25ST225MB23225的Datasheet PDF文件第1页浏览型号25ST225MB23225的Datasheet PDF文件第3页 
POLYMER MULTI-LAYER CAPACITORS  
PMLCAP  
Ⓡ
5. OPERATING TEMPERATURE  
Use capacitors within the specified temperature range.  
If used outside the specified temperature range, then the electrical characteristics may deteriorate significantly, leading  
to failure.  
The temperature referred to here includes the ambient temperature including heat produced by heat generating devices  
(power transistors, resistors, etc.), self heating due to ripple current.  
6. SOLDERING  
1）Soldering method  
●MU series, MS series, MR series  
MU series, MS series and MR series shall be used in reflow soldering and flow solderingꢀmethoed. Do not use in  
VPS soldering method.  
●ST series  
ST series shall be used in only reflow method. Do not use in flow, dipping and VPS soldering method. Please confirm  
your reflow conditions (reflow time, temperature). Soldering conditions should be according as recommended reflow  
temperature profile.  
●LDT series  
LDT series shall be used in only flow method. Do not use in reflow and VPS soldering method.  
2）MSL  
Moisture Sensitive Level (MSL) which is based on IPC/JEDEC J-STD-020D is showed in the following table.  
Chip size  
1608  
2012  
3216  
3225  
4532  
5750  
1632  
3245  
MSL  
3
168  
3
168  
3
168  
4
96  
5
48  
5
48  
4
72  
5
48  
※
Floor life time (hours)  
※Floor life time is the case of humidity control under 30℃60%RH.  
3）Solder paste (Chip type)  
A recommended thickness of solder paste is between 0.1mm to 0.2mm. The content of halogen in the soldering flux  
should be 0.1wt% or less.  
4）Tentative mounting (Chip type)  
This product can not be used again when the double-stick tape is used for tentative mounting.  
123

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