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2504026017Y0 PDF预览

2504026017Y0

更新时间: 2022-05-18 23:05:45
品牌 Logo 应用领域
飞来 - FAIR-RITE /
页数 文件大小 规格书
3页 293K
描述
MULTI-LAYER CHIP BEAD

2504026017Y0 数据手册

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Fair-Rite Product's Catalog  
Part Data Sheet, 2504026017Y0  
Printed: 2010-11-09  
Fair-Rite Products Corp. PO Box J,One Commercial Row, Wallkill, NY 12589-0288  
Phone: (888) 324-7748 www.fair-rite.com  
Part Number:  
2504026017Y0  
Frequency Range: Low Current  
Description:  
Application:  
Where Used:  
Part Type:  
MULTI-LAYER CHIP BEAD  
Suppression Components  
Board Component  
Chip Beads  
Preferred Part:  
Mechanical Specifications  
Weight:  
.002  
(g)  
Part Type Information  
Fair-Rite offers a broad selection of cost effective multi-layer chip beads to suppress conducted EMI signals. Chip beads can be used  
in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate automated placements  
and allow for a dense packaging of circuit boards. Chip beads are 100% tested for impedance and dc resistance. They are available in  
standard, high and GHz signal speeds. The multi-layer chip beads are organized by increasing package size and current carrying capacity.  
-All multi-layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided.  
-The impedance values listed are typical values. The nominal impedance with a ± 25% tolerance is specified for the + marked 100 MHz.  
Chip beads are measured for impedance on the HP 4291A and fixture HP 16192A.  
-Chip beads have plated contacts, 100% tin over a nickel undercoating. They can accommodate both reflow and wave soldering technologies.  
-The suggested land patterns are in accordance to the latest revision of IPC-7351.  
-Recommended storage and operating temperature range is -55°C to 125°C.  
-Our 'Chip Bead Kit' (part number 0199000018) is available for prototype evaluation.  

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