Board Mountable
DC-DC Converters
IMS 7 Series
Description of Options
Table 17: Survey of options
Function
Option
SMD version with pins
SMD version with PCB lid
Open frame version
C-pinout
M
L
Z
C
Option C
09119
4
The C-pinout configures the electrically isolated double out-
puts to the "industrial pinout" Vo1+, Vo2– with common
ground Go. With the C-pinout the converter height is in-
creased by the adapter PCB (see also: Mechanical Data).
Top view
50
Option M and L
Surface mount version
Note: Precautions should be taken when reflow soldering
the SMD version. The reflow soldering instructions below
should be strictly adhered to. An inadequate soldering proc-
ess may permanently damage the converter or degrade its
performance and Power-One will not honour any guaran-
tee/warranty claims resulting from damage caused by ig-
noring the soldering instructions.
Fig. 29
Proposed solder lands option M
3.6 (1.4")
Foot print
Infrared soldering is not permitted.
The surface mountable version of this product is assem-
bled with high melting point solder (227°C) to ensure that
the solder joints of of the internal components do not de-
grade in the end users SMD soldering process.
8 x 5 (1.9")
This product is only specified for "Forced Convection
Reflow Soldering" (Hot Air). Any conventional soldering
profile is acceptable provided that the restriction curve be-
low is not exceeded at any time during the reflow process.
Fig. 30
Proposed solder lands option L
Tpeak [°C]
11051
240
235
230
225
220
215
210
t [s]
205
50
0
20
30
40
10
Fig. 28
Forced convection reflow soldering restriction curve
measured on pin 2
Accessories
Mounting supports for chassis and DIN-rail mounting.
Edition 6/4.2000
16/16