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231217661423

更新时间： 2023-07-15 00:00:00
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 203K
描述
Fixed Resistor, Thin Film, 0.2W, 14200ohm, 150V, 0.25% +/-Tol, 25ppm/Cel, Surface Mount, 0904, MELF, ROHS COMPLIANT

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MMU 0102, MMA 0204, MMB 0207 - Precision  
Precision MELF Resistors  
Vishay Beyschlag  
TEST PROCEDURES AND REQUIREMENTS  
EN  
IEC  
60115-1 60068-2 (4)  
REQUIREMENTS  
PERMISSIBLE CHANGE (R)  
TEST  
PROCEDURE  
CLAUSE  
TEST  
METHOD  
STABILITY  
CLASS 0.05  
OR BETTER  
STABILITY  
CLASS 0.1  
OR BETTER  
STABILITY  
CLASS 0.25  
OR BETTER  
Stability for product types:  
MMU 0102  
MMA 0204  
100  
100  
100  
to 100 k  
to 100 k  
to 270 k  
43  
43  
43  
to 147 k  
to 221 k  
to 510 k  
22  
10  
to 332 k  
to 511 k  
MMB 0207  
15 to 1 M  
U = 15 x P70 x R  
Periodic electric  
overload;  
2 x Umax.  
;
(1)  
4.37  
4.22  
-
(0.5 %  
R
R
+ 5 m  
)
)
standard  
operation mode  
0.1 s on; 2.5 s off;  
1000 cycles  
Endurance by sweeping;  
10 Hz to 2000 Hz;  
no resonance; amplitude  
1.5 mm or 200 m/s2; 7.5 h  
6 (Fc)  
Vibration  
(0.01 %  
R
+ 5 m  
)
(0.02 %  
+ 5 m  
(0.03 %  
R
+ 5 m)  
IEC 61340-3-1 (4)  
;
Electrostatic  
discharge  
(Human Body  
Model)  
3 pos. + 3 neg. discharges  
MMU 0102: 1.5 kV  
MMA 0204: 2 kV  
(1)  
4.40  
-
(0.5 % R + 50 m)  
MMB 0207: 4 kV  
Solder bath method;  
SnPb40; non-activated flux;  
(215 3) C; (3 0.3) s  
Good tinning (  
Good tinning (  
95 % covered); no visible damage  
95 % covered); no visible damage  
4.17.2  
58 (Td)  
Solderability  
Solder bath method;  
SnAg3Cu0.5 or SnAg3.5;  
non-activated flux;  
(235 3) C; (2 0.2) s  
Solder bath method;  
(260 5) C; (10 1) s  
Note (2)  
(0.05 %  
R
+ 10 m  
)
Resistance to  
soldering heat  
4.18.2  
58 (Td)  
Reflow method 2  
(IR/forced gas convection);  
(260 5) C; (10 1) s  
(0.01 %  
R
+ 5 m  
)
(0.025 %  
R
+ 5 m  
)
Component  
solvent  
resistance  
Isopropyl alcohol; 50 C;  
No visible damage  
4.29  
4.30  
45 (XA)  
45 (XA)  
method 2  
Solvent  
resistance of  
marking  
Isopropyl alcohol; 50 C;  
method 1, toothbrush  
Marking legible; no visible damage  
No visible damage  
4.32  
4.33  
21 (Ue3)  
21 (Ue1)  
Shear (adhesion)  
45 N  
No visible damage, no open circuit in bent position  
Substrate  
bending  
Depth 2 mm, 3 times  
URMS = Uins; 60 s  
(3)  
(3)  
(0.02 %  
R
+ 10 m)  
(0.05 % R + 10 m)  
4.7  
-
-
Voltage proof  
Flammability  
No flashover or breakdown  
IEC 60 695-11-5 (4)  
needle flame test; 10 s  
,
4.35  
No burning after 30 s  
Notes  
(1) The pulse load stability of professional MELF resistors applies for precision resistors also. However, severe pulse loads are likely to jeopardize  
precision stability requirements.  
(2) Wave soldering is not recommended.  
(3) Special requirements apply to MICRO-MELF, MMU 0102:  
- R < 100  (0.15 % R + 10 m).  
- 100    
R 10 k 0.1 % R.  
- R > 10 k: 0.05 %  
R
.
(4)  
The quoted IEC standards are also released as EN standards with the same number and identical contents.  
www.vishay.com  
48  
For technical questions, contact: melf@vishay.com  
This document is subject to change without notice.  
Document Number: 28714  
Revision: 05-Mar-12  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
1...5678910

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