Datasheet > 2101C100M0000VAC

2101C100M0000VAC

更新时间： 2023-02-26 15:47:51

品牌	Logo	应用领域
美高森美 - MICROSEMI		/
页数	文件大小	规格书
26页	1219K
描述
CMOS Output Clock Oscillator,

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2101C100M0000VAC 数据手册

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SEMICONDUCTOR ENHANCED ELEMENT EVALUATION

Mil-PRF-

38534

Subgroup Class

Test

Mil-STD-750

Quantity

Reference

Paragraph

Method

Condition

(accept number)

Element Electrical

A. May perform at wafer level

B. All failures shall be removed

from the lot

Perform at room

ambient

100%

C.3.3.1

C.3.3.2

2069, 2070,

2072, 2073

2069, 2070,

Element Visual

Internal Visual

100%

10(0) or 22(0)

(Notes 1 & 2)

C.3.3.3

C.3.3.4.2

C.3.3.3

2072, 2073, 2074

Temperature Cycling

Surge Current

(when applicable)

1051

4066

A or B as

specified

Constant Acceleration

2006

2001

Y1 direction

20,000 G /

10,000 G for

Pd ≥ 10W

10(0)

22(0)

(See Notes 1 & 2)

Interim Electrical

C.3.3.4.3

1039

1042

1038

High Temperature

Reverse Bias (HTRB)

Complete

Within 16 hrs of

HTRB

Interim Electrical & Delta

completion

1039, 1042

1038

B, A

Burn-In 240 hours

1040

Post Burn-In Electrical

C.3.3.4.3

1026

1037

1042

1048

Steady State Life

1000 hours or equivalent

per MIL-PRF-19500

Final Electrical

C.3.3.4.3

C.3.3.3

C.3.3.5

10(0) wires or

20(1) wires

See method 2018

or 2077 & Note 2

Wire Bond Evaluation

2011

2018

2077

SEM

C.3.3.6

NOTES:

1. Subgroups 3, 4, & 5 shall be performed on a sample of 10 die if the wafer lot is from a QPL/QML line. If the die are

from commercial wafer lots, then the sample size shall be 22 die. Die from QPL/QML wafers not meeting the QPL/QML

requirements and downgraded to commercial grade shall not be used.

2. Subgroups 3, 4 & 5 shall be performed in the order listed in Table 1. Subgroup 6 may be performed at any time.

CODE IDENT NO.

UNSPECIFIED TOLERANCES

SIZE

DWG NO.

REV.

SHEET

00136

N/A

DOC200103

1...22 23 242526

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